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DS1230ABL-70 PDF预览

DS1230ABL-70

更新时间: 2024-11-04 20:28:23
品牌 Logo 应用领域
达拉斯 - DALLAS 静态存储器内存集成电路
页数 文件大小 规格书
10页 83K
描述
Non-Volatile SRAM Module, 32KX8, 70ns, CMOS,

DS1230ABL-70 技术参数

生命周期:TransferredReach Compliance Code:unknown
风险等级:5.62Is Samacsys:N
最长访问时间:70 ns其他特性:DATA RETENTION > 10 YEARS
JESD-30 代码:R-XDFP-U34内存密度:262144 bit
内存集成电路类型:NON-VOLATILE SRAM MODULE内存宽度:8
功能数量:1端口数量:1
端子数量:34字数:32768 words
字数代码:32000工作模式:ASYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:32KX8输出特性:3-STATE
可输出:YES封装主体材料:UNSPECIFIED
封装等效代码:MODULE,34LEAD,1.0封装形状:RECTANGULAR
封装形式:FLATPACK并行/串行:PARALLEL
电源:5 V认证状态:Not Qualified
最大待机电流:0.005 A子类别:SRAMs
最大压摆率:0.085 mA最大供电电压 (Vsup):5.25 V
最小供电电压 (Vsup):4.75 V标称供电电压 (Vsup):5 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子形式:J INVERTED
端子位置:DUALBase Number Matches:1

DS1230ABL-70 数据手册

 浏览型号DS1230ABL-70的Datasheet PDF文件第2页浏览型号DS1230ABL-70的Datasheet PDF文件第3页浏览型号DS1230ABL-70的Datasheet PDF文件第4页浏览型号DS1230ABL-70的Datasheet PDF文件第5页浏览型号DS1230ABL-70的Datasheet PDF文件第6页浏览型号DS1230ABL-70的Datasheet PDF文件第7页 
DS1230Y/AB  
DS1230Y/AB  
256K Nonvolatile SRAM  
FEATURES  
PIN ASSIGNMENT  
10 years minimum data retention in the absence of  
external power  
A14  
A12  
A7  
1
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
V
CC  
2
WE  
A13  
A8  
Data is automatically protected during power loss  
3
DIP-package devices directly replace 32K x 8 volatile  
static RAM or EEPROM  
A6  
4
A5  
5
A9  
Unlimited write cycles  
A4  
6
A11  
OE  
Low-power CMOS  
A3  
7
Read and write access times as fast as 70 ns  
A2  
8
A10  
CE  
A1  
9
Lithium energy source is electrically disconnected to  
retainfreshness until power is applied for the firsttime  
A0  
10  
11  
12  
13  
14  
DQ7  
DQ6  
DQ5  
DQ4  
DQ3  
DQ0  
DQ1  
DQ2  
GND  
Full ±10% V operating range (DS1230Y)  
CC  
Optional ±5% V operating range (DS1230AB)  
CC  
o
Optional industrial temperature range of -40 C to  
o
+85 C, designated IND  
28-PIN ENCAPSULATED PACKAGE  
740 MIL EXTENDED  
JEDEC standard 28-pin DIP package  
Low Profile Module (LPM) package  
Fits into standard 68-pin PLCC surface-mount-  
able sockets  
250 mil package height  
NC  
NC  
NC  
NC  
1
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
NC  
NC  
A14  
A13  
A12  
A11  
A10  
A9  
A8  
A7  
A6  
A5  
2
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
16  
17  
PIN DESCRIPTION  
A0 - A14  
DQ0 - DQ7  
CE  
-
-
-
-
-
-
-
Address Inputs  
Data In/Data Out  
Chip Enable  
Write Enable  
Output Enable  
Power (+5V)  
Ground  
V
CC  
WE  
OE  
CE  
WE  
OE  
V
DQ7  
DQ6  
DQ5  
DQ4  
DQ3  
DQ2  
DQ1  
DQ0  
GND  
CC  
GND  
A4  
A3  
A2  
A1  
A0  
34–PIN LOW PROFILE MODULE (LPM)  
ECopyright 1995 by Dallas Semiconductor Corporation.  
All Rights Reserved. For important information regarding  
patents and other intellectual property rights, please refer to  
Dallas Semiconductor data books.  
100395 1/10  

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