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DRV8842 PDF预览

DRV8842

更新时间: 2024-09-18 12:55:27
品牌 Logo 应用领域
德州仪器 - TI 驱动器
页数 文件大小 规格书
18页 665K
描述
DC MOTOR DRIVER IC

DRV8842 数据手册

 浏览型号DRV8842的Datasheet PDF文件第2页浏览型号DRV8842的Datasheet PDF文件第3页浏览型号DRV8842的Datasheet PDF文件第4页浏览型号DRV8842的Datasheet PDF文件第5页浏览型号DRV8842的Datasheet PDF文件第6页浏览型号DRV8842的Datasheet PDF文件第7页 
DRV8842  
www.ti.com  
SLVSAB8D MAY 2010REVISED JANUARY 2012  
DC MOTOR DRIVER IC  
Check for Samples: DRV8842  
1
FEATURES  
2
Single H-Bridge Current-Control Motor Driver  
Thermally Enhanced Surface Mount Package  
Drives One DC Motor, One Coil of a Stepper  
Motor, or Other Actuators  
APPLICATIONS  
Printers  
Five-Bit Winding Current Control Allows Up  
to 32 Current Levels  
Scanners  
Low MOSFET On-Resistance  
Office Automation Machines  
Gaming Machines  
Factory Automation  
Robotics  
5-A Maximum Drive Current at 24 V, 25°C  
Built-In 3.3-V Reference Output  
Industry-Standard PWM Control Interface  
8.2-V to 45-V Operating Supply Voltage Range  
DESCRIPTION  
The DRV8842 provides an integrated motor driver solution for printers, scanners, and other automated  
equipment applications. The device has one H-bridge driver, and is intended to drive one DC motor, one coil of a  
stepper motor, or other loads. The output driver block consists of N-channel power MOSFETs configured as an  
H-bridge. The DRV8842 can supply up to 5-A peak or 3.5-A RMS output current (with proper heatsinking at 24 V  
and 25°C).  
Separate inputs to independently control each half of the H-bridge are provided.  
Internal shutdown functions are provided for over current protection, short circuit protection, under voltage  
lockout and overtemperature.  
TheDRV8842 is available in a 28-pin HTSSOP package with PowerPAD(Eco-friendly: RoHS & no Sb/Br).  
ORDERING INFORMATION(1)  
ORDERABLE PART  
NUMBER  
TOP-SIDE  
MARKING  
TA  
PACKAGE(2)  
40°C to 85°C  
PowerPAD(HTSSOP) - PWP  
Reel of 2000  
DRV8842PWPR  
8842  
(1) For the most current packaging and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
web site at www.ti.com.  
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
PowerPAD is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 20102012, Texas Instruments Incorporated  

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