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DRV8839

更新时间: 2024-09-18 12:25:11
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德州仪器 - TI 驱动器
页数 文件大小 规格书
17页 846K
描述
LOW VOLTAGE DUAL 1/2-H-BRIDGE DRIVER IC

DRV8839 数据手册

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DRV8839  
www.ti.com  
SLVSBN4 JANUARY 2013  
LOW VOLTAGE DUAL ½-H-BRIDGE DRIVER IC  
Check for Samples: DRV8839  
1
FEATURES  
2
Dual ½-H-Bridge Motor Driver  
APPLICATIONS  
Drives a DC Motor or One Winding of a  
Stepper Motor, or Other Loads  
Battery-Powered:  
DSLR Lenses  
Consumer Products  
Toys  
Low MOSFET On-Resistance:  
HS + LS 280 mΩ  
1.8-A Maximum Drive Current  
Robotics  
1.8-V to 11-V Motor Operating Supply Voltage  
Range  
Cameras  
Medical Devices  
Separate Motor and Logic Supply Pins  
Individual ½-H-Bridge Control Input Interface  
Low-Power Sleep Mode With 120-nA Maximum  
Combined Supply Current  
2-mm x 3-mm 12-Pin WSON Package  
DESCRIPTION  
The DRV8839 provides a versatile power driver solution for cameras, consumer products, toys, and other  
low-voltage or battery-powered applications. The device has two independent ½-H-bridge drivers and can drive  
one DC motor or one winding of a stepper motor, as well as other devices like solenoids. The output stages use  
N-channel power MOSFET’s configured as ½-H-bridges. An internal charge pump generates needed gate drive  
voltages.  
The DRV8839 can supply up to 1.8-A of output current. It operates on a motor power supply voltage from 1.8 V  
to 11 V and a device power supply voltage of 1.8 V to 7 V.  
The DRV8839 has independent input and enable pins for each ½-H-bridge which allow independent control of  
each output.  
Internal shutdown functions are provided for over current protection, short circuit protection, under voltage  
lockout and overtemperature.  
The DRV8839 is packaged in a 12-pin, 2-mm x 3-mm WSON package with PowerPAD™ (Eco-friendly: RoHS &  
no Sb/Br).  
ORDERING INFORMATION(1)  
ORDERABLE PART  
NUMBER  
TOP-SIDE  
MARKING  
PACKAGE(2)  
PowerPAD™ (WSON) - DSS  
Reel of 3000  
DRV8839DSSR  
8839  
(1) For the most current packaging and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
web site at www.ti.com.  
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
PowerPAD is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2013, Texas Instruments Incorporated  

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