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DPG60B600LB PDF预览

DPG60B600LB

更新时间: 2024-11-26 01:21:19
品牌 Logo 应用领域
IXYS /
页数 文件大小 规格书
5页 202K
描述
High Performance Fast Recovery Diode Low Loss and Soft Recovery 1~ Rectifier Bridge

DPG60B600LB 数据手册

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DPG60B600LB  
=
=
=
VRRM  
IDAV  
trr  
600V  
60A  
HiPerFRED  
40ns  
High Performance Fast Recovery Diode  
Low Loss and Soft Recovery  
1~ Rectifier Bridge  
Part number  
DPG60B600LB  
Backside: isolated  
8 = n/c  
4
5
6
9
7
1
2
3
SMPD  
Features / Advantages:  
Applications:  
Package:  
Planar passivated chips  
Very low leakage current  
Very short recovery time  
Improved thermal behaviour  
Very low Irm-values  
Rectifiers in switch mode power  
supplies (SMPS)  
Isolation Voltage:  
Industry convenient outline  
RoHS compliant  
Epoxy meets UL 94V-0  
Soldering pins for PCB mounting  
Backside: DCB ceramic  
Reduced weight  
V~  
3000  
Very soft recovery behaviour  
Avalanche voltage rated for reliable operation  
Soft reverse recovery for low EMI/RFI  
Low Irm reduces:  
Advanced power cycling  
- Power dissipation within the diode  
- Turn-on loss in the commutating switch  
Terms Conditions of usage:  
The data contained in this product data sheet is exclusively intended for technically trained staff. The user will have to evaluate the suitability of the product for the intended application and  
the completeness of the product data with respect to his application. The specifications of our components may not be considered as an assurance of component characteristics. The  
information in the valid application- and assembly notes must be considered. Should you require product information in excess of the data given in this product data sheet or which concerns  
the specific application of your product, please contact your local sales office.  
Due to technical requirements our product may contain dangerous substances. For information on the types in question please contact your local sales office.  
Should you intend to use the product in aviation, in health or life endangering or life support applications, please notify. For any such application we urgently recommend  
- to perform joint risk and quality assessments;  
- the conclusion of quality agreements;  
- to establish joint measures of an ongoing product survey, and that we may make delivery dependent on the realization of any such measures.  
IXYS reserves the right to change limits, conditions and dimensions.  
Data according to IEC 60747and per semiconductor unless otherwise specified  
20140108a  
© 2014 IXYS all rights reserved  

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