DP0150ADJ / DP0150BDJ
DUAL PNP SURFACE MOUNT TRANSISTOR
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Features
Mechanical Data
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Epitaxial Planar Die Construction
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Case: SOT-963
Ideally Suited for Automated Assembly Processes
Lead Free By Design/RoHS Compliant (Note 1)
"Green" Device (Note 2)
Case Material: Molded Plastic, “Green” Molding Compound. UL
Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminals: Finish ⎯ Matte Tin annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
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Ultra Small Package
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Marking Information: See Page 3
Ordering Information: See Page 3
Weight: 0.0027 grams (approximate)
SOT-963
4
6
5
Q2
Q1
2
1
3
Top View
Device Schematic
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Collector-Base Voltage
Symbol
Value
-50
Unit
V
VCBO
VCEO
VEBO
IC
-50
V
Collector-Emitter Voltage
-5
V
Emitter-Base Voltage
Collector Current - Continuous
Base Current
-100
-30
mA
mA
IB
Thermal Characteristics
Characteristic
Power Dissipation (Note 3)
Symbol
PD
Value
300
Unit
mW
°C/W
°C
Thermal Resistance, Junction to Ambient (Note 3)
Operating and Storage Temperature Range
417
Rθ
JA
-55 to +150
TJ, TSTG
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic
OFF CHARACTERISTICS (Note 4)
Collector-Base Breakdown Voltage
Collector-Emitter Breakdown Voltage
Emitter-Base Breakdown Voltage
Collector Cut-Off Current
Symbol
Min
Typ
Max
Unit
Test Condition
-50
-50
-5
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-0.1
-0.1
V
V
V
V(BR)CBO
V(BR)CEO
V(BR)EBO
ICBO
IC = -10μA, IE = 0
IC = -1mA, IB = 0
IE = -10μA, IC = 0
VCB = -50V, IE = 0
VEB = -5V, IC = 0
μA
μA
Emitter Cut-Off Current
IEBO
ON CHARACTERISTICS (Note 4)
Collector-Emitter Saturation Voltage
DC Current Gain
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120
200
-0.15
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-0.3
240
400
V
VCE(SAT)
hFE
IC = -100mA, IB = -10mA
VCE = -6V, IC = -2mA
DP0150ADJ
DP0150BDJ
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SMALL SIGNAL CHARACTERISTICS
VCE = -10V, IE = 1mA
f = 30MHz
Transition Frequency
80
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MHz
fT
V
CB = -10V, IE = 0,
Output Capactiance
1.6
pF
Cob
f = 1MHz
Notes:
1. No purposefully added lead.
2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
3. Device mounted on FR-4 PCB with minimum recommended pad layout.
4. Measured under pulsed conditions. Pulse width = 300µs. Duty cycle ≤2%
1 of 4
www.diodes.com
April 2009
© Diodes Incorporated
DP0150ADJ / DP0150BDJ
Document number: DS31485 Rev. 3 - 2