DMP58D0SV
DUAL P-CHANNEL ENHANCEMENT MODE FIELD EFFECT TRANSISTOR
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Features
Mechanical Data
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Low On-Resistance
ESD Protected Gate to 500V
Low Input Capacitance
Fast Switching Speed
Lead Free By Design/RoHS Compliant (Note 3)
“Green” Device (Note 4)
Qualified to AEC-Q 101 Standards for High Reliability
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Case: SOT-563
Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminals: Finish ⎯ Matte Tin annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
Terminal Connections: See Diagram
Marking Information: See Page 3
Ordering Information: See Page 3
Weight: 0.006 grams (approximate)
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SOT-563
G1
S1
D2
G2
S2
D1
TOP VIEW
Internal Schematic
TOP VIEW
ESD protected to 500V
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Symbol
VDSS
VDGR
VGSS
ID
Value
-50
Units
V
Drain-Source Voltage
Drain-Gate Voltage (Note 1)
-50
±20
-160
V
V
Gate-Source Voltage
Drain Current (Note 2)
Continuous
Continuous
mA
Thermal Characteristics @TA = 25°C unless otherwise specified
Characteristic
Total Power Dissipation (Note 2)
Thermal Resistance, Junction to Ambient (Note 2)
Operating and Storage Temperature Range
Symbol
PD
Rθ
Value
400
313
Units
mW
°C/W
°C
JA
-55 to +150
TJ, TSTG
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic
OFF CHARACTERISTICS (Note 5)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Body Leakage
Symbol Min Typ Max Unit
Test Condition
VGS = 0V, ID = -250μA
-50
⎯
V
BVDSS
IDSS
⎯
⎯
⎯
⎯
-1
μA VDS = -50V, VGS = 0V
μA VGS = ±20V, VDS = 0V
IGSS
⎯
±5
ON CHARACTERISTICS (Note 5)
Gate Threshold Voltage
-0.8
⎯
0.05
-2.1
8
V
Ω
S
VGS(th)
RDS (ON)
gFS
⎯
6
VDS = VGS, ID = -250μA
VGS = -5V, ID = -0.100A
VDS = -25V, ID = -0.1A
Static Drain-Source On-Resistance
Forward Transconductance
DYNAMIC CHARACTERISTICS
Input Capacitance
⎯
⎯
27
4
pF
pF
pF
Ciss
Coss
Crss
⎯
⎯
⎯
⎯
⎯
⎯
Output Capacitance
VDS = -25V, VGS = 0V, f = 1.0MHz
Reverse Transfer Capacitance
1.4
Notes:
1. RGS ≤ 20KΩ.
2. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
3. No purposefully added lead.
4. Diodes Inc’s “Green” policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Short duration pulse test used to minimize self-heating effect.
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www.diodes.com
July 2009
© Diodes Incorporated
DMP58D0SV
Document number: DS31293 Rev. 4 - 2