DMP57D5UV
DUAL P-CHANNEL ENHANCEMENT MODE MOSFET
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Features
Mechanical Data
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Low On-Resistance
ESD Protected Gate to 1kV
Low Input Capacitance
Fast Switching Speed
Lead Free By Design/RoHS Compliant (Note 2)
“Green” Device (Note 3)
Qualified to AEC-Q 101 Standards for High Reliability
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Case: SOT-563
Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminals: Finish ⎯ Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202, Method 208
Terminal Connections: See Diagram
Marking Information: See Page 3
Ordering Information: See Page 3
Weight: 0.006 grams (approximate)
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G1
S1
D2
SOT-563
G2
S2
D1
TOP VIEW
Internal Schematic
ESD protected to 1kV
TOP VIEW
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Symbol
VDSS
VGSS
ID
Value
-50
Units
V
Drain-Source Voltage
Gate-Source Voltage
Drain Current (Note 2)
Continuous
Continuous
V
±8
-160
mA
Thermal Characteristics @TA = 25°C unless otherwise specified
Characteristic
Total Power Dissipation (Note 1)
Thermal Resistance, Junction to Ambient (Note 1)
Operating and Storage Temperature Range
Symbol
PD
Rθ
Value
400
313
Units
mW
°C/W
°C
JA
-55 to +150
TJ, TSTG
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic
OFF CHARACTERISTICS (Note 4)
Symbol Min Typ Max Unit
Test Condition
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Body Leakage
-50
⎯
⎯
V
BVDSS
IDSS
⎯
⎯
⎯
⎯
-10
VGS = 0V, ID = -250μA
μA VDS = -50V, VGS = 0V
nA
IGSS
±500
VGS = ±8V, VDS = 0V
ON CHARACTERISTICS (Note 4)
Gate Threshold Voltage
-0.7
-1.0
V
VGS(th)
⎯
4.6
6.0
VDS = VGS, ID = -250μA
GS = -4V, ID = -100mA
VGS = -2.5V, ID = -80mA
VDS = -5V, ID = -100mA
VGS = 0V, IS = -100mA
V
⎯
⎯
100
6
8
Static Drain-Source On-Resistance
RDS (ON)
Ω
Forward Transfer Admittance
Diode Forward Voltage
mS
V
⏐Yfs⏐
VSD
⎯
⎯
⎯
-1.2
⎯
DYNAMIC CHARACTERISTICS
Input Capacitance
29
7.3
2.5
pF
pF
pF
Ciss
Coss
Crss
⎯
⎯
⎯
⎯
⎯
⎯
Output Capacitance
V
DS = -25V, VGS = 0V, f = 1.0MHz
Reverse Transfer Capacitance
Notes:
1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead.
3. Diodes Inc’s “Green” policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
4. Short duration pulse test used to minimize self-heating effect.
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www.diodes.com
April 2009
© Diodes Incorporated
DMP57D5UV
Document number: DS31540 Rev. 3 - 2