DMN10H170
N-CHANNEL HIGH VOLTAGE MOSFET
FEATURES
VDS=100V,RDS(ON)≤140mΩ@VGS=10V,ID=12A
Low On-Resistance and Low Input Capacitance
For Analog Switch, Power Management Functions and DC-DC Converters
Applications
Surface Mount device
TO-252
MECHANICAL DATA
Case: TO-252
Case Material: Molded Plastic. UL flammability
Classification Rating: 94V-0
Weight: 0.33 grams (approximate)
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Parameter
Drain-source voltage
Symbol
VDS
Value
100
Unit
V
Gate-source voltage
VGS
±20
V
TC = +25°C
Continuous drain current, VGS =10V(1)
TC= +100°C
12
7.5
A
A
ID
Maximum Body Diode Forward Current (1)
Pulsed drain current (10μs Pulse, Duty Cycle = 1%)
Avalanche Current, L = 1.43mH, TJ= +25°C
Avalanche Energy, L = 1.43mH, TJ= +25°C
IS
IDM
IAS
EAS
4
16
5.3
20
42
17
A
A
A
mJ
TC= +25°C
Power dissipation(1)
TC= +100°C
PD
W
RθJA
RθJc
TJ,TSTG
Thermal resistance from Junction to ambient (1)
Thermal Resistance, Junction to Case (1)
Operating and Storage temperature
44
3
°C/W
°C/W
°C
-55 ~+150
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise specified)
Parameter
Symbol Min Typ Max Unit
Conditions
VGS=0V, ID=250μA
V(BR)DSS
Drain-Source breakdown voltage(2)
Zero gate voltage drain current(2)
Gate-body leakage current(2)
Gate-threshold voltage (2)
100
V
IDSS
IGSS
VGS(th)
1
±100
3.0
140
160
1.0
uA VDS=100V,
nA VDS=0V,
VGS=±20V
V
mΩ VGS=10V, ID=5A
mΩ VGS=4.5V, ID=5A
V
pF
pF
pF
Ω
VGS=0V
1.0
2.0
99
104
0.7
1167
36
25
VDS=VGS, ID=250μA
Drain-source on-resistance (2)
RDS(ON)
Diode forward voltage (2)
Input capacitance (3)
Output capacitance(3)
Reverse transfer capacitance(3)
Gate Resistance(3)
VSD
Ciss
Coss
Crss
Rg
IS=10A, VGS=0V
VDS=25V, VGS=0V, f=1MHz
VDS=0V, VGS=0V, f=1MHz
1.3
Turn-on delay time(3)
Turn-on rise time(3)
Turn-off delay time(3)
Turn-off fall time(3)
Total Gate Charge(3)
Total gate charge(3)
Gate-source charge(3)
Gate-drain charge(3)
Body Diode Reverse Recovery Time(3)
Body Diode Reverse Recovery Charge(3)
Notes:1. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
2. Short duration pulse test used to minimize self-heating effect.
td(on)
tr
td(off)
tf
Qg
Qg
Qgs
Qgd
trr
10.5
11.1
42.6
12.8
4.9
9.7
2.0
2.0
30.3
35.2
nS
nS
nS
nS
nC
nC
nC
nC
nS
nC
VDD=50V, ID=12.8A,
Rg=25Ω
VDS=80V,VGS=4.5V,ID=12.8A
VDS=80V,VGS=10V,ID=12.8A
VGS=0V,IS=12.8A,
di/dt= 100A/μs
Qrr
3. Guaranteed by design. Not subject to production testing.
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