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DMN10H100 PDF预览

DMN10H100

更新时间: 2024-11-19 18:09:31
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合科泰 - HOTTECH /
页数 文件大小 规格书
6页 1002K
描述
TO-252

DMN10H100 数据手册

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DMN10H100  
N-CHANNEL HIGH VOLTAGE MOSFET  
FEATURES  
VDS=100V,RDS(ON)≤80mΩ@VGS=10V,ID=18A  
Low RDS(ON) – ensures on state losses are minimized  
For Power Management Functions and DC-DC Converters Applications  
Surface Mount device  
TO-252  
MECHANICAL DATA  
Case: TO-252  
Case Material: Molded Plastic. UL flammability  
Classification Rating: 94V-0  
Weight: 0.33 grams (approximate)  
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)  
Parameter  
Drain-source voltage  
Gate-source voltage  
TC = +25°C  
Continuous drain current, VGS = 10V(1)  
TC= +70°C  
Symbol  
VDS  
Value  
Unit  
V
V
A
A
100  
±20  
18  
VGS  
ID  
14  
IDM  
IAS  
Pulsed drain current (380μs Pulse, Duty Cycle = 1%)  
Avalanche Current, L = 1mH  
16  
8
A
A
Avalanche Energy, L = 1mH  
EAS  
32.6  
37  
24  
mJ  
TC= +25°C  
Power dissipation(1)  
TC= +70°C  
PD  
W
RθJA  
RθJc  
TJ,TSTG  
Thermal resistance from Junction to ambient (1)  
Thermal Resistance, Junction to Case (1)  
Operating and Storage temperature  
46  
3.3  
-55 ~+150  
°C/W  
°C/W  
°C  
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise specified)  
Parameter  
Symbol Min Typ Max Unit  
Conditions  
VGS=0V, ID=250μA  
V(BR)DSS  
Drain-Source breakdown voltage(2)  
Zero gate voltage drain current(2)  
Gate-body leakage current(2)  
Gate-threshold voltage (2)  
100  
V
IDSS  
IGSS  
VGS(th)  
1
±100  
3.0  
80  
100  
uA VDS=80V,  
nA VDS=0V,  
VGS=±20V  
V
VGS=10V, ID=3.3A  
VGS=6V, ID=3A  
VGS=0V  
1.0  
2.0  
65  
70  
VDS=VGS, ID=250μA  
Drain-source on-resistance (2)  
RDS(ON)  
V
Diode forward voltage (2)  
Input capacitance (3)  
Output capacitance(3)  
Reverse transfer capacitance(3)  
Gate Resistance(3)  
VSD  
Ciss  
Coss  
Crss  
Rg  
0.77  
1172  
40.8  
31.3  
1.6  
IS=3.2A, VGS=0V  
VDS=50V, VGS=0V, f=1MHz  
VDS=0V, VGS=0V, f=1MHz  
pF  
pF  
pF  
Ω
Turn-on delay time(3)  
Turn-on rise time(3)  
Turn-off delay time(3)  
Turn-off fall time(3)  
Total Gate Charge(3)  
Total gate charge(3)  
Gate-source charge(3)  
Gate-drain charge(3)  
Body Diode Reverse Recovery Time(3)  
Body Diode Reverse Recovery Charge(3)  
Notes:1. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.  
2. Short duration pulse test used to minimize self-heating effect.  
td(on)  
tr  
td(off)  
tf  
Qg  
Qg  
Qgs  
Qgd  
trr  
5.4  
5.9  
20  
7.3  
12.2  
25.2  
5.3  
5.9  
19.7  
15.9  
nS  
nS  
nS  
nS  
nC  
nC  
nC  
nC  
nS  
nC  
VDD=50V, ID=3.3A,  
Rg=6.0Ω  
VDS=50V,VGS=4.5V,ID=3.3A  
VDD=50V,VGS=10V,ID=3.3A  
IS=3.3A,di/dt= 100A/μs  
Qrr  
3. Guaranteed by design. Not subject to production testing.  
1 / 6  
©GUANGDONG HOTTECH INDUSTRIAL CO.,LTD  
E-mail:hkt@heketai.com  

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