SPICE MODEL: DMMT5551
DMMT5551/DMMT5551S
Lead-free Green
MATCHED NPN SMALL SIGNAL SURFACE MOUNT
TRANSISTOR
Features
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Epitaxial Planar Die Construction
Complementary PNP Type Available (DMMT5401)
A
Ideal for Low Power Amplification and Switching
Intrinsically Matched NPN Pair (Note 1)
2% Matched Tolerance, hFE, VCE(SAT), VBE(SAT)
Lead Free/RoHS Compliant (Note 4)
"Green" Device (Note 5 and 6)
SOT-26
C
B
Dim Min Max Typ
A
B
C
D
F
0.35 0.50 0.38
1.50 1.70 1.60
2.70 3.00 2.80
H
¾
¾
¾
¾
0.95
0.55
K
J
M
Mechanical Data
H
J
2.90 3.10 3.00
0.013 0.10 0.05
1.00 1.30 1.10
0.35 0.55 0.40
0.10 0.20 0.15
F
L
D
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Case: SOT-26
Case Material: Molded Plastic, "Green" Molding
Compound, Note 7. UL Flammability Classification
Rating 94V-0
K
L
M
a
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Moisture Sensitivity: Level 1 per J-STD-020C
Terminal Connections: See Diagram
E2
C2
E1
E1
C2
C1
0°
8°
¾
Terminals: Solderable per MIL-STD-202, Method 208
All Dimensions in mm
Lead Free Plating (Matte Tin Finish annealed over
Copper leadframe).
B1
E2
B2
C1
B1
B2
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Marking (See Page 2): K4R & K4T
DMMT5551S
(K4T Marking Code)
DMMT5551
(K4R Marking Code)
Ordering & Date Code Information: See Page 2
Weight: 0.006 grams (approximate)
@ TA = 25°C unless otherwise specified
Characteristic
Maximum Ratings
Symbol
VCBO
VCEO
VEBO
IC
Value
180
Unit
V
Collector-Base Voltage
Collector-Emitter Voltage
160
V
Emitter-Base Voltage
6.0
V
Collector Current - Continuous (Note 2)
Power Dissipation (Note 2, 3)
200
mA
mW
°C/W
°C
Pd
300
RqJA
Thermal Resistance, Junction to Ambient (Note 2)
Operating and Storage and Temperature Range
417
Tj, TSTG
-55 to +150
Notes: 1. Built with adjacent die from a single wafer.
2. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout
document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
3. Maximum combined dissipation.
4. No purposefully added lead.
5. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php..
6. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to
Date Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DS30436 Rev. 7 - 2
1 of 4
DMMT5551/DMMT5551S
www.diodes.com
ã Diodes Incorporated