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DMMT5551_1 PDF预览

DMMT5551_1

更新时间: 2024-09-30 03:30:07
品牌 Logo 应用领域
美台 - DIODES 晶体晶体管
页数 文件大小 规格书
4页 97K
描述
MATCHED NPN SMALL SIGNAL SURFACE MOUNT TRANSISTOR

DMMT5551_1 数据手册

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SPICE MODEL: DMMT5551  
DMMT5551/DMMT5551S  
Lead-free Green  
MATCHED NPN SMALL SIGNAL SURFACE MOUNT  
TRANSISTOR  
Features  
·
·
·
·
·
·
·
Epitaxial Planar Die Construction  
Complementary PNP Type Available (DMMT5401)  
A
Ideal for Low Power Amplification and Switching  
Intrinsically Matched NPN Pair (Note 1)  
2% Matched Tolerance, hFE, VCE(SAT), VBE(SAT)  
Lead Free/RoHS Compliant (Note 4)  
"Green" Device (Note 5 and 6)  
SOT-26  
C
B
Dim Min Max Typ  
A
B
C
D
F
0.35 0.50 0.38  
1.50 1.70 1.60  
2.70 3.00 2.80  
H
¾
¾
¾
¾
0.95  
0.55  
K
J
M
Mechanical Data  
H
J
2.90 3.10 3.00  
0.013 0.10 0.05  
1.00 1.30 1.10  
0.35 0.55 0.40  
0.10 0.20 0.15  
F
L
D
·
·
Case: SOT-26  
Case Material: Molded Plastic, "Green" Molding  
Compound, Note 7. UL Flammability Classification  
Rating 94V-0  
K
L
M
a
·
·
·
·
Moisture Sensitivity: Level 1 per J-STD-020C  
Terminal Connections: See Diagram  
E2  
C2  
E1  
E1  
C2  
C1  
0°  
8°  
¾
Terminals: Solderable per MIL-STD-202, Method 208  
All Dimensions in mm  
Lead Free Plating (Matte Tin Finish annealed over  
Copper leadframe).  
B1  
E2  
B2  
C1  
B1  
B2  
·
·
·
Marking (See Page 2): K4R & K4T  
DMMT5551S  
(K4T Marking Code)  
DMMT5551  
(K4R Marking Code)  
Ordering & Date Code Information: See Page 2  
Weight: 0.006 grams (approximate)  
@ TA = 25°C unless otherwise specified  
Characteristic  
Maximum Ratings  
Symbol  
VCBO  
VCEO  
VEBO  
IC  
Value  
180  
Unit  
V
Collector-Base Voltage  
Collector-Emitter Voltage  
160  
V
Emitter-Base Voltage  
6.0  
V
Collector Current - Continuous (Note 2)  
Power Dissipation (Note 2, 3)  
200  
mA  
mW  
°C/W  
°C  
Pd  
300  
RqJA  
Thermal Resistance, Junction to Ambient (Note 2)  
Operating and Storage and Temperature Range  
417  
Tj, TSTG  
-55 to +150  
Notes: 1. Built with adjacent die from a single wafer.  
2. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout  
document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.  
3. Maximum combined dissipation.  
4. No purposefully added lead.  
5. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php..  
6. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to  
Date Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.  
DS30436 Rev. 7 - 2  
1 of 4  
DMMT5551/DMMT5551S  
www.diodes.com  
ã Diodes Incorporated  

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