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DMMT5401_2 PDF预览

DMMT5401_2

更新时间: 2024-11-02 09:54:11
品牌 Logo 应用领域
美台 - DIODES 晶体晶体管
页数 文件大小 规格书
4页 111K
描述
MATCHED PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR

DMMT5401_2 数据手册

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DMMT5401  
MATCHED PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR  
Features  
A
Epitaxial Planar Die Construction  
SOT-26  
Complementary NPN Type Available (DMMT5551)  
Ideal for Low Power Amplification and Switching  
Intrinsically Matched PNP Pair (Note 1)  
2% Matched Tolerance, hFE, VCE(SAT), VBE(SAT)  
Lead Free/RoHS Compliant (Note 4)  
C2  
E2  
E1  
Dim Min Max Typ  
A
B
C
D
F
0.35 0.50 0.38  
1.50 1.70 1.60  
2.70 3.00 2.80  
C
B
B2  
C1  
B1  
"Green" Device (Note 5 and 6)  
0.95  
0.55  
Mechanical Data  
H
H
J
2.90 3.10 3.00  
0.013 0.10 0.05  
1.00 1.30 1.10  
0.35 0.55 0.40  
0.10 0.20 0.15  
Case: SOT-26  
K
J
M
Case Material: Molded Plastic, "Green" Molding  
Compound, Note 6. UL Flammability Classification  
Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020C  
Terminal Connections: See Diagram  
Terminals: Solderable per MIL-STD-202, Method 208  
Lead Free Plating (Matte Tin Finish annealed over  
Copper leadframe).  
K
L
F
L
D
M
α
E
1
E
2
C
2
0°  
8°  
All Dimensions in mm  
Marking Information: K4S, See Page 3  
Ordering & Date Code Information: See Page 3  
Weight: 0.006 grams (approximate)  
C
1
B
1
B
2
Maximum Ratings @TA = 25°C unless otherwise specified  
Characteristic  
Collector-Base Voltage  
Collector-Emitter Voltage  
Emitter-Base Voltage  
Collector Current - Continuous (Note 2)  
Power Dissipation (Note 2, 3)  
Symbol  
VCBO  
VCEO  
VEBO  
IC  
Value  
-160  
-150  
-5.0  
-200  
300  
Unit  
V
V
V
mA  
mW  
°C/W  
Pd  
Thermal Resistance, Junction to Ambient (Note 2)  
417  
Rθ  
JA  
Operating and Storage Temperature Range  
-55 to +150  
Tj, TSTG  
°C  
Notes:  
1.  
2.  
Built with adjacent die from a single wafer.  
Device mounted on FR5 PCB: 1.0 x 0.75 x 0.62 in.; pad layout as shown on suggested pad layout document AP02001, which can be found on our  
website at http://www.diodes.com/datasheets/ap02001.pdf.  
3.  
4.  
5.  
6.  
Maximum combined dissipation.  
No purposefully added lead.  
Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.  
Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date  
Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.  
DS30437 Rev. 6 - 2  
1 of 4  
DMMT5401  
© Diodes Incorporated  
www.diodes.com  

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