DMMT5401
MATCHED PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR
Features
A
•
•
•
•
•
•
•
Epitaxial Planar Die Construction
SOT-26
Complementary NPN Type Available (DMMT5551)
Ideal for Low Power Amplification and Switching
Intrinsically Matched PNP Pair (Note 1)
2% Matched Tolerance, hFE, VCE(SAT), VBE(SAT)
Lead Free/RoHS Compliant (Note 4)
C2
E2
E1
Dim Min Max Typ
A
B
C
D
F
0.35 0.50 0.38
1.50 1.70 1.60
2.70 3.00 2.80
C
B
B2
C1
B1
"Green" Device (Note 5 and 6)
0.95
0.55
⎯
⎯
⎯
⎯
Mechanical Data
•
•
H
H
J
2.90 3.10 3.00
0.013 0.10 0.05
1.00 1.30 1.10
0.35 0.55 0.40
0.10 0.20 0.15
Case: SOT-26
K
J
M
Case Material: Molded Plastic, "Green" Molding
Compound, Note 6. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Terminal Connections: See Diagram
Terminals: Solderable per MIL-STD-202, Method 208
Lead Free Plating (Matte Tin Finish annealed over
Copper leadframe).
K
L
F
L
D
•
•
•
•
M
α
E
1
E
2
C
2
0°
8°
⎯
All Dimensions in mm
•
•
•
Marking Information: K4S, See Page 3
Ordering & Date Code Information: See Page 3
Weight: 0.006 grams (approximate)
C
1
B
1
B
2
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current - Continuous (Note 2)
Power Dissipation (Note 2, 3)
Symbol
VCBO
VCEO
VEBO
IC
Value
-160
-150
-5.0
-200
300
Unit
V
V
V
mA
mW
°C/W
Pd
Thermal Resistance, Junction to Ambient (Note 2)
417
Rθ
JA
Operating and Storage Temperature Range
-55 to +150
Tj, TSTG
°C
Notes:
1.
2.
Built with adjacent die from a single wafer.
Device mounted on FR5 PCB: 1.0 x 0.75 x 0.62 in.; pad layout as shown on suggested pad layout document AP02001, which can be found on our
website at http://www.diodes.com/datasheets/ap02001.pdf.
3.
4.
5.
6.
Maximum combined dissipation.
No purposefully added lead.
Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DS30437 Rev. 6 - 2
1 of 4
DMMT5401
© Diodes Incorporated
www.diodes.com