SPICE MODEL: DMMT5401
DMMT5401
Lead-free Green
MATCHED PNP SMALL SIGNAL SURFACE MOUNT
TRANSISTOR
Features
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Epitaxial Planar Die Construction
A
SOT-26
Complementary NPN Type Available (DMMT5551)
Ideal for Low Power Amplification and Switching
Intrinsically Matched PNP Pair (Note 1)
2% Matched Tolerance, hFE, VCE(SAT), VBE(SAT)
Lead Free/RoHS Compliant (Note 4)
E2
C2
E1
Dim Min Max Typ
A
B
C
D
F
0.35 0.50 0.38
1.50 1.70 1.60
2.70 3.00 2.80
C
B
C1
B1
B2
"Green" Device, Note 5 and 6
¾
¾
0.95
0.55
H
¾
¾
K
M
H
J
2.90 3.10 3.00
0.013 0.10 0.05
1.00 1.30 1.10
0.35 0.55 0.40
0.10 0.20 0.15
Mechanical Data
J
F
L
D
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Case: SOT-26
K
L
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Case Material: Molded Plastic, "Green" Molding
Compound, Note 7. UL Flammability Classification
Rating 94V-0
M
a
E1
E2
C2
0°
8°
¾
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Moisture Sensitivity: Level 1 per J-STD-020C
Terminal Connections: See Diagram
All Dimensions in mm
Terminals: Solderable per MIL-STD-202, Method 208
C1
B1
B2
Lead Free Plating (Matte Tin Finish annealed over
Copper leadframe).
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Marking (See Page 2): K4S
Order & Date Code Information: See Page 2
Weight: 0.006 grams (approximate)
@ TA = 25°C unless otherwise specified
Symbol
Maximum Ratings
Characteristic
Value
-160
Unit
V
VCBO
VCEO
VEBO
IC
Collector-Base Voltage
Collector-Emitter Voltage
-150
V
Emitter-Base Voltage
-5.0
V
Collector Current - Continuous (Note 2)
Power Dissipation (Note 2, 3)
-200
mA
mW
°C/W
°C
Pd
300
R
Thermal Resistance, Junction to Ambient (Note 2)
Operating and Storage and Temperature Range
417
qJA
Tj, TSTG
-55 to +150
Notes: 1. Built with adjacent die from a single wafer.
2. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout
document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
3. Maximum combined dissipation.
4. No purposefully added lead.
5. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
6. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to
Date Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DS30437 Rev. 5 - 2
1 of 4
DMMT5401
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ã Diodes Incorporated