DMMT3906
MATCHED PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR
Features
•
•
•
•
•
•
Epitaxial Planar Die Construction
Intrinsically Matched PNP Pair (Note 1)
Small Surface Mount Package
A
SOT-26
Dim Min Max Typ
B1,2
C1
C2
A
B
C
D
F
0.35 0.50 0.38
1.50 1.70 1.60
2.70 3.00 2.80
2% hFE Matched Tolerance
C
B
Lead Free/RoHS Compliant (Note 3)
"Green" Device (Note 4 and 5)
NC
E1
E2
0.95
0.55
⎯
⎯
⎯
⎯
Mechanical Data
•
•
H
Case: SOT-26
H
J
2.90 3.10 3.00
0.013 0.10 0.05
1.00 1.30 1.10
0.35 0.55 0.40
0.10 0.20 0.15
Case Material: Molded Plastic, "Green" Molding
Compound, Note 5. UL Flammability Classification
Rating 94V-0
Terminal Connections: See Diagram
Terminals: Solderable per MIL-STD-202, Method 208
Lead Free Plating (Matte Tin Finish annealed over
Copper leadframe).
K
J
M
K
L
•
•
•
L
D
F
M
All Dimensions in mm
•
•
•
Marking Information: See Page 3
Ordering Information: See Page 3
Weight: 0.015 grams (approximate)
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current - Continuous
Power Dissipation (Note 2)
Symbol
VCBO
VCEO
VEBO
IC
Value
-40
-40
-5.0
-200
225
556
Unit
V
V
V
mA
mW
Pd
Thermal Resistance, Junction to Ambient (Note 2)
°C/W
°C
Rθ
JA
Operating and Storage Temperature Range
-55 to +150
Tj, TSTG
Notes:
1.
2.
Built with adjacent die from a single wafer.
Device mounted on FR5 PCB: 1.0 x 0.75 x 0.62 in.; pad layout as shown on suggested pad layout document AP02001, which can be found on our
website at http://www.diodes.com/datasheets/ap02001.pdf.
3.
4.
5.
No purposefully added lead.
Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DS30293 Rev. 6 - 2
1 of 4
DMMT3906
© Diodes Incorporated
www.diodes.com