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DM512K72DT6-15N PDF预览

DM512K72DT6-15N

更新时间: 2024-01-23 02:06:14
品牌 Logo 应用领域
铁电 - RAMTRON 动态存储器内存集成电路
页数 文件大小 规格书
26页 254K
描述
Cache DRAM Module, 512KX72, 35ns, MOS, DIMM-168

DM512K72DT6-15N 技术参数

是否Rohs认证:不符合生命周期:Active
包装说明:DIMM, DIMM168Reach Compliance Code:compliant
风险等级:5.83Is Samacsys:N
最长访问时间:15 nsI/O 类型:COMMON
JESD-30 代码:R-PDMA-N168内存密度:37748736 bit
内存集成电路类型:EDO DRAM MODULE内存宽度:72
端子数量:168字数:524288 words
字数代码:512000最高工作温度:70 °C
最低工作温度:组织:512KX72
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:DIMM封装等效代码:DIMM168
封装形状:RECTANGULAR封装形式:MICROELECTRONIC ASSEMBLY
电源:5 V认证状态:Not Qualified
刷新周期:1024座面最大高度:38.1 mm
最大待机电流:0.011 A子类别:DRAMs
最大压摆率:1.97 mA标称供电电压 (Vsup):5 V
表面贴装:NO技术:CMOS
温度等级:COMMERCIAL端子形式:NO LEAD
端子节距:1.27 mm端子位置:DUAL
Base Number Matches:1

DM512K72DT6-15N 数据手册

 浏览型号DM512K72DT6-15N的Datasheet PDF文件第2页浏览型号DM512K72DT6-15N的Datasheet PDF文件第3页浏览型号DM512K72DT6-15N的Datasheet PDF文件第4页浏览型号DM512K72DT6-15N的Datasheet PDF文件第5页浏览型号DM512K72DT6-15N的Datasheet PDF文件第6页浏览型号DM512K72DT6-15N的Datasheet PDF文件第7页 
DM512K64DT6/DM512K72DT6 Multibank EDO  
EDRAM  
512Kb x 64/512Kb x 72 Enhanced DRAM DIMM  
Enhanced  
Memory Systems Inc.  
Product Specification  
Features  
8Kbytes SRAM Cache Memory for 12ns Random Reads Within Four On-chip Cache Hit/Miss Comparators Automatically Maintain Cache  
Active Pages (Multibank Cache)  
Coherency on Writes  
Fast 4Mbyte DRAM Array for 30ns Access to Any New Page  
Write Posting Registers for 12ns Random Writes and Burst Writes  
Within a Page (Hit or Miss)  
Hidden Precharge & Refresh Cycles  
Extended 64ms Refresh Period for Low Standby Power  
CMOS/TTL Compatible I/O and +5 Volt Power Supply  
Output Latch Enable Allows Extended Data Output (EDO) for  
Faster System Operation  
2Kbyte Wide DRAM to SRAM Bus for 113.6 Gigabytes/Second  
Cache Fill Rate  
A Hit Pin Outputs Status on On-chip Page Hit/Miss Comparators to  
Simplify Control  
Description  
Architecture  
The DM512K72DT6 achieves  
512Kb x 72 density by mounting  
The Enhanced Memory Systems 4MB enhanced DRAM  
(EDRAM)DIMM module provides a single memory module solution  
for the main memory or local memory of fast 64-bit embedded  
computers, communications switches, and other high performance  
systems. Due to its fast non-interleave architecture, the EDRAM DIMM  
module supports zero-wait-state burst read or write operation to  
83MHz. The EDRAM outperforms conventional SRAM plus DRAM or  
synchronous DRAM memory systems by minimizing wait states on  
initial reads (hit or miss) and eliminating writeback delays.  
Each 4Mbyte DIMM module has 8Kbytes of SRAM cache  
organized as four 256 x 72 row registers with 12ns initial access  
time. On a cache miss, the fast DRAM array reloads an entire 2Kbyte  
row register over a 2Kbyte-wide bus in just 18ns for an effective cache  
fill rate of 113.6 Gbytes/second. During write cycles, a write posting  
register allows the initial write to be posted as early as 5ns after  
column address is available. EDRAM supports direct non-interleave  
page writes at up to 83MHz. An on-chip hit/miss comparator  
automatically maintains cache coherency during writes.  
nine 512Kx8 EDRAMs, packaged  
in low profile 44-pin TSOP-II  
packages on one side of the multi-  
layer substrate. Three high drive  
series terminated buffer chips  
buffer address and control lines.  
Twelve surface mount capacitors  
are used to decouple the power  
supply bus. The DM512K64DT  
contains eight 512Kx8 EDRAMs.  
The parity data component is not  
populated.  
The EDRAM memory module architecture is very similar to two  
standard 2MB DRAM SIMM modules configured in a 64-bit wide,  
non-interleave configuration. The EDRAM module adds an integrated  
cache and cache control logic which allow the cache to operate much  
like a page mode or static column DRAM.  
The EDRAM’s SRAM cache is  
integrated into the DRAM array as tightly  
coupled row registers. Memory reads  
always occur from the 256 x 72 cache  
row register associated with a 1MB  
Functional Diagram  
A
0-7  
Column  
Add  
Latch  
CAL  
0-8  
Column Decoder  
segment of DRAM. When the on-chip  
4- 256 X 72 Cache Pages  
(Row Register)  
comparator detects a page hit, only the  
4-Bit  
Comp  
/QLE  
SRAM is accessed and data is available  
Sense Amps  
& Column Write Select  
/G  
in 12ns from column address (the /HIT  
I/O  
Control  
and  
Data  
Latches  
4- Last  
Row  
Read  
Add  
Latches  
output is low to indicate a page hit).  
DQ  
When a page miss is detected, the entire  
new DRAM row is loaded into cache and  
data is available at the output within  
30ns from row enable (the /HIT output  
is high to indicate a page miss).  
0-71  
A
0-10  
/S  
Memory  
Array  
(4 Mbyte + Parity)  
Row  
Add  
Latch  
/WE  
Subsequent reads within a page (burst  
reads or random reads) will continue at  
12ns cycle time. Since reads occur from  
the SRAM cache, the DRAM precharge  
can occur simultaneously without  
degrading performance. The on-chip  
refresh counter with independent  
V
CC  
A
0-9  
C
1-12  
/F  
W/R  
/RE  
Row Add  
and  
Refresh  
Control  
V
SS  
Refresh  
Counter  
PD  
© 1996 Enhanced Memory Systems Inc. 1850 Ramtron Drive, Colorado Springs, CO  
Telephone (800) 545-DRAM; Fax (719) 488-9095; http://www.csn.net/ramtron/enhanced  
80921  
38-2123-000  
The information contained herein is subject to change without notice.  
Enhanced reserves the right to change or discontinue this product without notice.  

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