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DLP1700FQA PDF预览

DLP1700FQA

更新时间： 2024-11-18 12:55:27
品牌 Logo 应用领域
德州仪器 - TI 消费电路商用集成电路双倍数据速率
页数 文件大小 规格书
25页 1303K
描述
DLP® 0.17 HVGA DDR Series 210 DMD

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中文翻译

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DLP1700FQA 技术参数

是否无铅：不含铅是否Rohs认证：符合
生命周期：Obsolete零件包装代码：BCC
包装说明：GREEN, CERAMIC, LCC-46针数：46
Reach Compliance Code：compliantHTS代码：8542.39.00.01
风险等级：5.81Is Samacsys：N
商用集成电路类型：CONSUMER CIRCUITJESD-30 代码：R-CBCC-B46
长度：15.5 mm湿度敏感等级：1
功能数量：1端子数量：46
最高工作温度：70 °C最低工作温度：
封装主体材料：CERAMIC, METAL-SEALED COFIRED封装代码：LGA
封装形状：RECTANGULAR封装形式：CHIP CARRIER
峰值回流温度（摄氏度）：NOT SPECIFIED认证状态：Not Qualified
座面最大高度：4.383 mm最大供电电压 (Vsup)：3.6 V
最小供电电压 (Vsup)：2.25 V表面贴装：YES
温度等级：COMMERCIAL端子形式：BUTT
端子位置：BOTTOM处于峰值回流温度下的最长时间：NOT SPECIFIED
宽度：9 mmBase Number Matches：1

DLP1700FQA 数据手册

 浏览型号DLP1700FQA的Datasheet PDF文件第2页浏览型号DLP1700FQA的Datasheet PDF文件第3页浏览型号DLP1700FQA的Datasheet PDF文件第4页浏览型号DLP1700FQA的Datasheet PDF文件第5页浏览型号DLP1700FQA的Datasheet PDF文件第6页浏览型号DLP1700FQA的Datasheet PDF文件第7页 
DLP1700  
www.ti.com  
DLPS018B –DECEMBER 2009–REVISED SEPTEMBER 2011  
®
DLP 0.17 HVGA DDR Series 210 DMD  
Check for Samples: DLP1700  
1
FEATURES  
2
•
0.17-Inch Micromirror Array Diagonal  
•
Package Mates to a PANASONIC  
AXK5L46347G Socket  
–
480 × 320 Array of Aluminum,  
Micrometer-Sized Mirrors  
(Half-VGA Resolution )  
APPLICATIONS  
•
•
•
•
Structured Light  
–
–
7.6-µm Micromirror Pitch  
3D Optical Measurement Systems  
Augmented Reality  
±12° Micromirror Tilt Angle  
(Relative to Flat State)  
–
Designed for Corner Illumination  
Portable Embedded Displays  
•
Designed for Use With Broadband Visible  
Light (420 nm–720 nm):  
–
Window Transmission 97% (Single Pass,  
Through Two Window Surfaces)  
–
–
–
Micromirror Reflectivity 88%  
Array Diffraction Efficiency 86%  
Array Fill Factor 92%  
•
•
•
10-Bit, Double Data Rate (DDR) Input Data Bus  
60 MHz Input Data Clock Rate  
Electrical Power Consumption as  
Low as 84 mW  
•
•
•
Built-In Reset Driver Circuitry  
15.5 mm by 9 mm Package Footprint  
Package Includes a 46-pin Board-to-Board  
Connector  
DESCRIPTION  
The DLP1700 Digital Micromirror Device (DMD) is a digitally controlled MOEMS (micro-opto-electromechanical  
system) spatial light modulator (SLM). When coupled to an appropriate optical system, the DLP1700 can be used  
to modulate the amplitude, direction, and/or phase of incoming (illumination) light.  
Architecturally, the DLP1700 is a latchable, electrical-in/optical-out semiconductor device. This architecture  
makes the DLP1700 well suited for use in applications such as structured lighting, 3D optical metrology,  
augmented reality, microscopy, and spectroscopy. The compact physical size of the DLP1700 enables  
integration into portable equipment.  
The DLP1700 is one of three components in the DLP 0.17 HVGA chip-set (see Figure 1). Proper function and  
operation of the DLP1700 requires that it be used in conjunction with the other components of the chip-set. Refer  
to DLP 0.17 HVGA chip-set data sheet (TI literature number DLPS017) for further details.  
Electrically, the DLP1700 consists of a two-dimensional array of 1-bit CMOS memory cells, organized in a square  
grid of 480 memory cell columns by 320 memory cell rows. The CMOS memory array is written to on a  
column-by-column basis, over a 10-bit double data rate (DDR) bus. Row addressing is handled via a serial  
control bus. The specific CMOS memory access protocol is handled by the DLPC100 Digital Controller.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
DLP is a registered trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2009–2011, Texas Instruments Incorporated  
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