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DIM400XCM33-F000_11 PDF预览

DIM400XCM33-F000_11

更新时间: 2024-02-20 02:57:22
品牌 Logo 应用领域
DYNEX 双极性晶体管
页数 文件大小 规格书
8页 353K
描述
IGBT Chopper Module

DIM400XCM33-F000_11 数据手册

 浏览型号DIM400XCM33-F000_11的Datasheet PDF文件第2页浏览型号DIM400XCM33-F000_11的Datasheet PDF文件第3页浏览型号DIM400XCM33-F000_11的Datasheet PDF文件第4页浏览型号DIM400XCM33-F000_11的Datasheet PDF文件第5页浏览型号DIM400XCM33-F000_11的Datasheet PDF文件第6页浏览型号DIM400XCM33-F000_11的Datasheet PDF文件第7页 
DIM400XCM33-F000  
IGBT Chopper Module  
Replaces DS5938-1.0  
DS5938-2 May 2011 (LN28404)  
FEATURES  
KEY PARAMETERS  
10µs Short Circuit Withstand  
High Thermal Cycling Capability  
Soft Punch Through Silicon  
Isolated AlSiC Base with AlN Substrates  
Lead Free Construction  
VCES  
VCE(sat) * (typ)  
IC  
IC(PK)  
3300V  
2.8V  
400A  
800A  
(max)  
(max)  
* Measured at the auxiliary terminals  
10.2kV Isolation Package  
7(C)  
5(A)  
APPLICATIONS  
3(C)  
High Reliability Inverters  
Motor Controllers  
Traction Drives  
Choppers  
2(G)  
The Powerline range of high power modules includes  
half bridge, chopper, dual, single and bi-directional  
switch configurations covering voltages from 1200V to  
6500V and currents up to 2400A.  
1(E)  
6(E)  
4(K)  
The DIM400XCM33-F000 is a 3300V, soft punch  
through n-channel enhancement mode, insulated gate  
bipolar transistor (IGBT) chopper module. The IGBT  
has a wide reverse bias safe operating area (RBSOA)  
plus 10μs short circuit withstand. This device is  
optimised for traction drives and other applications  
requiring high thermal cycling capability.  
Fig. 1 Circuit configuration  
The module incorporates an electrically isolated base  
plate and low inductance construction enabling circuit  
designers to optimise circuit layouts and utilise  
grounded heat sinks for safety.  
ORDERING INFORMATION  
Order As:  
DIM400XCM33-F000  
Outline type code: X  
Note: When ordering, please use the complete part  
number  
(See Fig. 11 for further information)  
Fig. 2 Package  
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures  
1/8  
www.dynexsemi.com  

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