Datasheet > DH40225-60

DH40225-60

更新时间： 2024-11-22 04:17:43

品牌	Logo	应用领域
TEMEX		/
页数	文件大小	规格书
2页	52K
描述
Pin Diode, Silicon, SOD-323, PLASTIC PACKAGE-2

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DH40225-60 数据手册

SILICON PIN DIODES

Plastic package Surface Mount attenuating silicon PIN diodes

P LASTIC PACKAGE S URFACE MOUNT ATTENUATING

S ILICON P IN DIODES

Description

TEMEX uses its proprietary technology to m anufacture its Silicon PIN diodes in plastic package.

This product fam ily is designed for a low cost, m edium to high volum e m arket that m ay be supplied

in tape and reel for autom ated pick and place assem bly on surface m ount circuit boards.

The use of this technology elim inates wire bonding on to the chips.

Applications

Typical applications include variable RF attenuators and AGC (Autom atic Gain Control) circuits,

from MHz to several GHz.

The attenuating Pin diode uses properties of variation of forward series resistance versus the DC

forward bias current. In order to obtain the best dynam ic range, a single diode attenuator m ay be used

in series or shunt conﬁguration or designed as a m ultiple diode circuit (T or p circuit), where the device

m ay be m atched through the attenuation range.

Note:To reduce the distortion, it is necessary to verify and design with the following form ula:

πτ_lI

<< 1

RF peak current (A)

τ_l

Diode m inority carrier lifetim e (s)

DC bias current (A)

Application frequency (Hz)

Typical perform ance curve

Typical series resistance versus forward current

R_SF(Ω)

1000

100

DH40144

DH40225

DH40141

I_F(mA)

0.1

12-8

Vol. 1

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h tt p ://w w w .t e m ex.c o m

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