是否无铅: | 含铅 | 生命周期: | Obsolete |
零件包装代码: | SOIC | 包装说明: | TSSOP, TSSOP6,.08 |
针数: | 6 | Reach Compliance Code: | unknown |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.84 |
模拟集成电路 - 其他类型: | SPDT | JESD-30 代码: | R-PDSO-G6 |
JESD-609代码: | e0 | 长度: | 2 mm |
信道数量: | 1 | 功能数量: | 1 |
端子数量: | 6 | 最大通态电阻 (Ron): | 110 Ω |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TSSOP |
封装等效代码: | TSSOP6,.08 | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 峰值回流温度(摄氏度): | 240 |
电源: | 2.5/5 V | 认证状态: | Not Qualified |
座面最大高度: | 1.1 mm | 子类别: | Multiplexer or Switches |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 2.25 V |
标称供电电压 (Vsup): | 2.5 V | 表面贴装: | YES |
最长断开时间: | 35 ns | 最长接通时间: | 50 ns |
切换: | BREAK-BEFORE-MAKE | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | Tin/Lead (Sn/Pb) |
端子形式: | GULL WING | 端子节距: | 0.65 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | 30 |
宽度: | 1.25 mm |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
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Technical Product Specification |