是否无铅: | 不含铅 | 生命周期: | Obsolete |
零件包装代码: | DIP | 包装说明: | DIP, DIP18,.3 |
针数: | 18 | Reach Compliance Code: | unknown |
HTS代码: | 8542.39.00.01 | 风险等级: | 1.72 |
模拟集成电路 - 其他类型: | SINGLE-ENDED MULTIPLEXER | JESD-30 代码: | R-PDIP-T18 |
JESD-609代码: | e3 | 长度: | 37.4 mm |
湿度敏感等级: | 1 | 标称负供电电压 (Vsup): | -15 V |
信道数量: | 8 | 功能数量: | 1 |
端子数量: | 18 | 标称断态隔离度: | 75 dB |
通态电阻匹配规范: | 5 Ω | 最大通态电阻 (Ron): | 100 Ω |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | DIP |
封装等效代码: | DIP18,.3 | 封装形状: | RECTANGULAR |
封装形式: | IN-LINE | 峰值回流温度(摄氏度): | NOT SPECIFIED |
电源: | 12/+-15 V | 认证状态: | Not Qualified |
座面最大高度: | 5.08 mm | 最大信号电流: | 0.03 A |
子类别: | Multiplexer or Switches | 最大供电电流 (Isup): | 0.1 mA |
标称供电电压 (Vsup): | 15 V | 表面贴装: | NO |
最长断开时间: | 300 ns | 最长接通时间: | 225 ns |
切换: | BREAK-BEFORE-MAKE | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | Matte Tin (Sn) |
端子形式: | THROUGH-HOLE | 端子节距: | 2.54 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 15.24 mm | Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
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