是否无铅: | 含铅 | 生命周期: | Active |
零件包装代码: | SOIC | 包装说明: | SOP, SOP16,.25 |
针数: | 16 | Reach Compliance Code: | unknown |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.5 |
模拟集成电路 - 其他类型: | SPST | JESD-30 代码: | R-PDSO-G16 |
JESD-609代码: | e0 | 长度: | 9.9 mm |
标称负供电电压 (Vsup): | -15 V | 正常位置: | NO/NC |
信道数量: | 1 | 功能数量: | 4 |
端子数量: | 16 | 标称断态隔离度: | 91 dB |
最大通态电阻 (Ron): | 35 Ω | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 输出: | SEPARATE OUTPUT |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | SOP |
封装等效代码: | SOP16,.25 | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE | 峰值回流温度(摄氏度): | 240 |
电源: | 5,12/+-15 V | 认证状态: | Not Qualified |
座面最大高度: | 1.75 mm | 子类别: | Multiplexer or Switches |
标称供电电压 (Vsup): | 15 V | 表面贴装: | YES |
最长断开时间: | 90 ns | 最长接通时间: | 116 ns |
切换: | BREAK-BEFORE-MAKE | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | TIN LEAD |
端子形式: | GULL WING | 端子节距: | 1.27 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | 30 |
宽度: | 3.9 mm |
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