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DG200AAK/883B PDF预览

DG200AAK/883B

更新时间: 2024-10-30 20:06:51
品牌 Logo 应用领域
美信 - MAXIM /
页数 文件大小 规格书
4页 22K
描述
SPST,

DG200AAK/883B 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:ActiveReach Compliance Code:not_compliant
ECCN代码:EAR99HTS代码:8542.39.00.01
Factory Lead Time:18 weeks风险等级:2.26
模拟集成电路 - 其他类型:SPST湿度敏感等级:1
信道数量:1功能数量:2
端子数量:14封装主体材料:CERAMIC, GLASS-SEALED
封装形式:IN-LINE峰值回流温度(摄氏度):240
技术:CMOS端子位置:DUAL
处于峰值回流温度下的最长时间:20Base Number Matches:1

DG200AAK/883B 数据手册

 浏览型号DG200AAK/883B的Datasheet PDF文件第2页浏览型号DG200AAK/883B的Datasheet PDF文件第3页浏览型号DG200AAK/883B的Datasheet PDF文件第4页 
SCOPE: Dual, SPST, CMOS, TTL-Compatible Analog Switch  
Device Type:  
-1  
Generic Number:  
DG200AA(x)/883B  
Case Outline(s).  
Outline Letter  
Mil-Std-1835  
GDIP1-T14 or CDIP2-T14  
MACY1-X10  
Case Outline  
14 LEAD CERDIP  
10 Pin TO-100  
Package Code  
K
A
J14  
A10  
Absolute Maximum Ratings  
V+ to V- ..................................................................................................................................... 44V  
V+ to GND ................................................................................................................................. 25V  
Digital Input Overvoltage Range .....................................................…….….. (V- -2V) to (V+ +2V)  
Continuous Current, Any terminal ..........................................................................………... 30mA  
Current, S or D (Pulsed at 1ms, 10% duty cycle max) .......................................................... 100mA  
Lead Temperature (soldering, 10 seconds) ....................................................................…….... +300°C  
Storage Temperature .......................................................................................…….... -65°C to +150°C  
Continuous Power Dissipation ........................................................................…………….. TA=+70°C  
10 lead Can (derate 6.7mW/°C above +70°C) .............................................………………….. 533mW  
14 lead CERDIP(derate 10mW/°C above +70°C) ................................................…………..... 727mW  
Junction Temperature TJ .................................................................................………………. +150°C  
Thermal Resistance, Junction to Case, ΘJC:  
Case Outline 10 lead Can ...........................................................…………………..... 45°C/W  
Case Outline 14 lead CERDIP.............................................................…………….... 55°C/W  
Thermal Resistance, Junction to Ambient, ΘJA:  
Case Outline 10 lead Can ...........................................................………………….. 150°C/W  
Case Outline 14 lead CERDIP..........................................................…………….... 110°C/W  
Recommended Operating Conditions.  
Ambient Operating Range (TA) ...........................................................…………... -55°C to +125°C  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage  
to the device.These are stress ratings only, and functional operation of the device at these or any  
other conditions beyond those indicated in the operational sections of the specifications is not  
implied. Exposure to absolute maximum rating conditions for extended periods may affect  
device reliability.  
----------------------------  
Electrical Characteristics of DG200A/883B  
19-0053  
Page 2 of  
Rev. B  
5

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