DFR1A THRU DFR1M
1.0A Surface Mount Fast
Recovery Rectifiers-50-1000V
Features
Package outline
Glass passivated device
SOD-123
Ideal for surface mouted applications
Low reverse leakage
Cathode Band
Top View
Metallurgically bonded construction
High temperature soldering guaranteed:
250 C/10 seconds,0.375”(9.5mm) lead length,
5 lbs. (2.3kg) tension
Compliant to RoHS Directive 2011/65/EU
Compliant to Halogen-free
0.6±0.25
Mechanical data
Case: JEDEC SOD-123 molded plastic body over
passivated chip
Terminals: Plated axial leads, solderable per MIL-STD-750,
3.7±0.2
Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
Dimensions in millimeters
Maximum ratings and Electrical Characteristics (AT TA=25oC unless otherwise noted)
Symbol
TYP.
UNIT
A
MIN.
MAX.
PARAMETER
CONDITIONS
IO
Forward rectified current
See Fig.2
1.0
IFSM
25
Forward surge current
A
8.3ms single half sine-wave (JEDEC methode)
VR = VRRM TA = 25OC
VR = VRRM TA = 100OC
5.0
IR
Reverse current
μA
50
Junction to ambient
NOTE 1
OC/W
Thermal resistance
RθJA
50
15
CJ
pF
OC
Diode junction capacitance
Storage temperature
f=1MHz and applied 4V DC reverse voltage
+150
-65
TSTG
Operating
*5
*1
*3
*4
*2
VRMS
(V)
VR
VF
trr
SYMBOLS
VRRM
(V)
temperature
TJ, (OC)
(V)
(V)
(ns)
*1 Repetitive peak reverse voltage
*2 RMS voltage
50
35
50
DFR1A
DFR1B
DFR1D
100
200
400
70
100
200
400
150
140
280
*3 Continuous reverse voltage
*4 Maximum forward voltage@IF=1.0A
*5 Maximum Reverse recovery time, note 2
1.30
-55 to +150
DFR1G
600
800
420
560
700
600
800
250
500
DFR1J
DFR1K
DFR1M
1000
1000
Note:
1.P.C.B. mounted with 0.2x0.2”(5.0x5.0mm) copper pad areas
2. Reverse recovery time test condition, IF=0.5A, IR=1.0A, IRR=0.25A
http://www.anbonsemi.com
Document ID
AS-3020002
Issued Date
2003/03/08
Revised Date
Revision
Page.
TEL:+86-755-23776891
2019/03/16
E
3
Page 1
FAX:+86-755-81482182