Datasheet > DFLZ13

DFLZ13

更新时间： 2024-02-29 11:45:29

品牌	Logo	应用领域
美台 - DIODES		稳压二极管
页数	文件大小	规格书
3页	185K
描述
1.0W SURFACE MOUNT POWER ZENER DIODE

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技术参数
数据手册

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DFLZ13 技术参数

是否Rohs认证：	符合	生命周期：	Active
Reach Compliance Code：	not_compliant	ECCN代码：	EAR99
HTS代码：	8541.10.00.50	风险等级：	5.43
二极管类型：	ZENER DIODE	湿度敏感等级：	1
峰值回流温度（摄氏度）：	260	处于峰值回流温度下的最长时间：	10
Base Number Matches：	1

DFLZ13 数据手册

SPICE MODEL: DFLZ5V1 DFLZ5V6 DFLZ6V2 DFLZ6V8 DFLZ7V5 DFLZ8V2 DFLZ9V1 DFLZ10 DFLZ11 DFLZ12 DFLZ13 DFLZ15 DFLZ16

DFLZ18 DFLZ20 DFLZ22 DFLZ24 DFLZ27 DFLZ33 DFLZ36 DFLZ39

DFLZ5V1 - DFLZ39

1.0W SURFACE MOUNT POWER ZENER DIODE

PowerDI 123

Features

1W Power Dissipation on FR-4 PCB

Lead Free Finish, RoHS Compliant (Note 2)

"Green" Molding Compound (No Br, Sb)

Qualified to AEC-Q101 Standards for High Reliability

PowerDI 123

Dim Min

Max

3.90

3.00

1.93

1.00

1.25

0.25

0.85

—

Typ

3.70

2.80

1.78

0.98

1.00

0.20

0.65

1.35

1.10

0.20

1.05

3.50

2.60

1.63

0.93

0.85

0.15

0.45

—

Mechanical Data

Case: PowerDI 123

Case Material: Molded Plastic, “Green” Molding

Compound. UL Flammability Classification Rating 94V-0

Moisture Sensitivity: Level 1 per J-STD-020C

Terminal Connections: Cathode Band

Terminals: Finish - Matte Tin annealed over Copper

leadframe. Solderable per MIL-STD-202,

Method 208 e3

—

Marking & Type Code Information: See Electrical

Specifications Table and Page 3

—

0.90

1.30

Ordering Information: See Last Page

Weight: 0.01 grams (approximate)

All Dimensions in mm

@ T_A= 25°C unless otherwise specified

Maximum Ratings

Characteristic

Symbol

V_F

Value

1.2

Unit

Forward Voltage

@ I_F= 200mA

T_j,T_STG

Operating and Storage Temperature Range

-55 to +150

°C

@ T_A= 25°C unless otherwise specified

Thermal Characteristics

Characteristic

Symbol

Typ

Max

Unit

P_D

Power Dissipation (Note 1)

1.0

Thermal Resistance, Junction to Ambient Air (Note 1)

Thermal Resistance, Junction to Soldering Point (Note 3)

110

°C/W

qJA

qJS

Notes:

1. Device mounted on 1" x 1", FR-4 PCB; 2 oz. Cu pad layout as shown on Diodes Inc. suggested pad layout document AP02001.pdf.

2. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7.

3. Theoretical R

calculated from the top center of the die straight down to the PCB/cathode tab solder junction.

qJS

DS30464 Rev. 4 - 2

1 of 3

DFLZ5V1 - DFLZ39

PowerDI is a trademark of Diodes Incorporated.

www.diodes.com

ã Diodes Incorporated

12 3

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