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DFLZ12-7 PDF预览

DFLZ12-7

更新时间: 2024-11-28 03:29:23
品牌 Logo 应用领域
美台 - DIODES 稳压二极管齐纳二极管测试光电二极管PC
页数 文件大小 规格书
3页 185K
描述
1.0W SURFACE MOUNT POWER ZENER DIODE

DFLZ12-7 技术参数

是否无铅:含铅是否Rohs认证:符合
生命周期:Active包装说明:R-PDSO-F2
针数:2Reach Compliance Code:not_compliant
ECCN代码:EAR99HTS代码:8541.10.00.50
Factory Lead Time:24 weeks风险等级:1.7
Samacsys Confidence:4Samacsys Status:Released
Samacsys PartID:7768107Samacsys Pin Count:2
Samacsys Part Category:Zener DiodeSamacsys Package Category:Other
Samacsys Footprint Name:DFLZ12-7-4Samacsys Released Date:2020-02-04 15:04:48
Is Samacsys:N其他特性:HIGH RELIABILITY
外壳连接:CATHODE配置:SINGLE
二极管元件材料:SILICON二极管类型:ZENER DIODE
最大动态阻抗:1 ΩJESD-30 代码:R-PDSO-F2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
最高工作温度:150 °C最低工作温度:-55 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性:UNIDIRECTIONAL最大功率耗散:1 W
认证状态:Not Qualified标称参考电压:12 V
子类别:Voltage Reference Diodes表面贴装:YES
技术:ZENER端子面层:Matte Tin (Sn) - annealed
端子形式:FLAT端子位置:DUAL
处于峰值回流温度下的最长时间:40最大电压容差:5.39%
工作测试电流:50 mABase Number Matches:1

DFLZ12-7 数据手册

 浏览型号DFLZ12-7的Datasheet PDF文件第2页浏览型号DFLZ12-7的Datasheet PDF文件第3页 
SPICE MODEL: DFLZ5V1 DFLZ5V6 DFLZ6V2 DFLZ6V8 DFLZ7V5 DFLZ8V2 DFLZ9V1 DFLZ10 DFLZ11 DFLZ12 DFLZ13 DFLZ15 DFLZ16  
DFLZ18 DFLZ20 DFLZ22 DFLZ24 DFLZ27 DFLZ33 DFLZ36 DFLZ39  
DFLZ5V1 - DFLZ39  
1.0W SURFACE MOUNT POWER ZENER DIODE  
ä
PowerDI 123  
Features  
·
·
·
·
1W Power Dissipation on FR-4 PCB  
Lead Free Finish, RoHS Compliant (Note 2)  
"Green" Molding Compound (No Br, Sb)  
Qualified to AEC-Q101 Standards for High Reliability  
ä
PowerDI 123  
Dim Min  
Max  
3.90  
3.00  
1.93  
1.00  
1.25  
0.25  
0.85  
Typ  
3.70  
2.80  
1.78  
0.98  
1.00  
0.20  
0.65  
1.35  
1.10  
0.20  
1.05  
D
A
B
3.50  
2.60  
1.63  
0.93  
0.85  
0.15  
0.45  
Mechanical Data  
H
ä
·
Case: PowerDI 123  
A
C
·
Case Material: Molded Plastic, “Green” Molding  
Compound. UL Flammability Classification Rating 94V-0  
D
B
E
·
·
·
Moisture Sensitivity: Level 1 per J-STD-020C  
Terminal Connections: Cathode Band  
C
E
H
L
Terminals: Finish - Matte Tin annealed over Copper  
leadframe. Solderable per MIL-STD-202,  
Method 208 e3  
L1  
L2  
L3  
L4  
L
L1  
·
Marking & Type Code Information: See Electrical  
Specifications Table and Page 3  
E
L2  
0.90  
1.30  
·
·
Ordering Information: See Last Page  
Weight: 0.01 grams (approximate)  
L3  
L4  
All Dimensions in mm  
A
@ TA = 25°C unless otherwise specified  
Maximum Ratings  
Characteristic  
Symbol  
VF  
Value  
1.2  
Unit  
V
Forward Voltage  
@ IF = 200mA  
Tj, TSTG  
Operating and Storage Temperature Range  
-55 to +150  
°C  
@ TA = 25°C unless otherwise specified  
Thermal Characteristics  
Characteristic  
Symbol  
Typ  
¾
Max  
Unit  
W
PD  
Power Dissipation (Note 1)  
1.0  
¾
9
R
Thermal Resistance, Junction to Ambient Air (Note 1)  
Thermal Resistance, Junction to Soldering Point (Note 3)  
110  
¾
°C/W  
°C/W  
qJA  
qJS  
R
Notes:  
1. Device mounted on 1" x 1", FR-4 PCB; 2 oz. Cu pad layout as shown on Diodes Inc. suggested pad layout document AP02001.pdf.  
2. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7.  
3. Theoretical R  
calculated from the top center of the die straight down to the PCB/cathode tab solder junction.  
qJS  
DS30464 Rev. 4 - 2  
1 of 3  
DFLZ5V1 - DFLZ39  
PowerDI is a trademark of Diodes Incorporated.  
www.diodes.com  
ã Diodes Incorporated  

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