DFLU1400
1.0A SURFACE MOUNT SUPER-FAST RECTIFIER
PowerDI ®123
Features
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Glass Passivated Die Construction
Super-Fast Recovery Time for High Efficiency
Low Forward Voltage Drop and High Current Capability
Patented Interlocking Clip Design for High Surge Current
Capacity
Lead Free Finish, RoHS Compliant (Note 2)
"Green" Molding Compound (No Br, Sb)
Qualified to AEC-Q101 Standards for High Reliability
PowerDI®123
D
Dim Min Max Typ
H
A
B
3.50 3.90 3.70
2.60 3.00 2.80
1.63 1.93 1.78
0.93 1.00 0.98
0.85 1.25 1.00
0.15 0.25 0.20
0.45 0.85 0.65
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A
B
C
D
C
E
E
Mechanical Data
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Case: PowerDI®123
H
L
L1
L
Case Material: Molded Plastic, "Green" Molding
Compound. UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Terminal Connections: Cathode Band
Terminals: Finish – Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202, Method 208
Marking & Type Code Information: See Page 3
Ordering Information: See Page 3
L
L1
L2
L3
L4
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1.35
1.10
0.20
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E
L2
L3
L4
A
0.90 1.30 1.05
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All Dimensions in mm
Weight: 0.011 grams (approximate)
Maximum Ratings and Electrical Characteristics
@TA = 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Symbol
VRRM
VRWM
VR
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage (Note 5)
400
V
RMS Reverse Voltage
Average Rectified Output Current
280
1.0
V
A
VR(RMS)
IO
Non-Repetitive Peak Forward Surge Current 8.3ms
Single Half Sine-Wave Superimposed on Rated Load
Maximum Forward Voltage Drop
30
A
V
IFSM
VFM
IRM
1.25
@IF = 1.0A
@TA 25°C
@TA = 100°C
Peak Reverse Current
=
5.0
200
μA
at Rated DC Blocking Voltage (Note 5)
Maximum Reverse Recovery Time (Note 4)
Typical Total Capacitance (f = 1MHz, VR = 4VDC)
25
14
ns
pF
trr
CT
Thermal Characteristics
Characteristic
Power Dissipation (Note 1)
Symbol
PD
Typ
⎯
117
Max
1.0
Unit
W
@TA = 25°C
@TA = 25°C
°C/W
Thermal Resistance Junction to Ambient (Note 1)
⎯
Rθ
JA
Thermal Resistance Junction to Soldering Point (Note 3)
Operating and Storage Temperature Range
6
°C/W
⎯
Rθ
JS
-65 to +150
Tj, TSTG
°C
Notes: 1. Device mounted on 1" x 1", Polymide PCB; 2 oz. Cu pad layout as shown on Diodes Inc. suggested pad layout document AP02001.pdf.
2. RoHS revision 13.2.2003. Glass and high temperature solder exemptions applied, see EU Directive Annex Notes 5 and 7.
3. Theoretical RθJS calculated from the top center of the die straight down to the PCB cathode tab solder junction.
4. Measured with IF = 0.5A, IR = 1.0A, Irr = 0.25A. See figure 5.
5. Short duration pulse test used to minimize self-heating effect.
6. Device mounted on FR-4 PCB, 2oz. Cu pad layout as shown on Diodes Inc. suggested pad layout document AP02001.pdf. (see page 2)
DS30784 Rev. 2 - 2
PowerDI is a registered trademark of Diodes Incorporated.
1 of 3
DFLU1400
© Diodes Incorporated
www.diodes.com