DFLU1200
1.0A SURFACE MOUNT SUPER-FAST RECTIFIER
ä
PowerDI 123
Features
·
·
·
Glass Passivated Die Construction
Super-Fast Recovery Time for High Efficiency
ä
PowerDI 123
Patented Interlocking Clip Design for High Surge Current
Capacity
Dim Min
Max
3.90
3.00
1.93
1.00
1.25
0.25
0.85
—
Typ
3.70
2.80
1.78
0.98
1.00
0.20
0.65
1.35
1.10
0.20
1.05
D
·
·
·
Lead Free Finish, RoHS Compliant (Note 2)
"Green" Molding Compound (No Br, Sb)
A
B
3.50
2.60
1.63
0.93
0.85
0.15
0.45
—
H
A
B
Qualified to AEC-Q101 Standards for High Reliability
C
Mechanical Data
·
D
Case: PowerDIä123
E
C
E
·
Case Material: Molded Plastic, "Green" Molding
Compound. UL Flammability Classification Rating
94V-0
H
L
L1
L2
L3
L4
L
L1
L
·
·
·
Moisture Sensitivity: Level 1 per J-STD-020C
Terminal Connections: Cathode Band
—
—
—
—
E
L2
Terminals: Finish – Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202,
0.90
1.30
L3
L4
Method 208
e
3
A
All Dimensions in mm
·
·
·
Marking & Type Code Information: See Last Page
Ordering Information: See Last Page
Weight: 0.01 grams (approximate)
TA = 25°C unless otherwise specified
Maximum Ratings and Electrical Characteristics
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Symbol
Value
Unit
VRRM
VRWM
VR
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage (Note 5)
200
V
VR(RMS)
IO
RMS Reverse Voltage
140
1.0
V
A
Average Rectified Output Current (see figure 4)
Non-Repetitive Peak Forward Surge Current
IFSM
VFM
IRM
30
A
V
8.3ms Single half sine-wave Superimposed on Rated Load
Forward Voltage Drop
@ IF = 0.6A
@ IF = 1.0A
0.90
0.98
5.0
200
Peak Reverse Current
at Rated DC Blocking Voltage (Note 5)
@ TA
@ TA = 100°C
= 25°C
mA
trr
Reverse Recovery Time (Note 4)
25
27
ns
Typical Total Capacitance (f = 1MHz, VR = 4VDC)
CT
pF
Thermal Characteristics
Characteristic
Symbol
Typ
Max
1.0
6
Unit
W
PD
RqJS
Power Dissipation (Note 1) @ TA = 25°C
¾
Thermal Resistance Junction to Soldering Point (Note 3)
Thermal Resistance Junction to Ambient (Note 1) @TA = 25°C
Thermal Resistance Junction to Ambient (Note 6) @TA = 25°C
Operating and Storage Temperature Range
¾
°C/W
°C/W
°C/W
°C
RqJA
116
¾
RqJA
182
¾
Tj, TSTG
-65 to +150
Notes: 1. Device mounted on 1" x 1", Polymide PCB; 2 oz. Cu pad layout as shown on Diodes Inc. suggested pad layout document AP02001.pdf.
2. RoHS revision 13.2.2003. Glass and high temperature solder exemptions applied, see EU Directive Annex Notes 5 and 7.
3. Theoretical R
calculated from the top center of the die straight down to the PCB cathode tab solder junction.
qJS
4. Measured with I = 0.5A, I = 1.0A, I = 0.25A. See figure 7.
F
R
rr
5. Short duration pulse test to minimize self-heating effect.
6. Device mounted on FR-4 PCB, 2 oz. Copper, minimum recommended pad layout pattern per http://www.diodes.com/datasheets/ap02001.pdf
DS30601 Rev. 3 - 2
1 of 3
DFLU1200
PowerDI is a trademark of Diodes Incorporated.
www.diodes.com
ã Diodes Incorporated