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DF6A6.8FUT1/D PDF预览

DF6A6.8FUT1/D

更新时间: 2024-11-08 23:46:51
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
4页 47K
描述
Quad Array for ESD Protection

DF6A6.8FUT1/D 数据手册

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DF6A6.8FUT1  
Quad Array for  
ESD Protection  
This quad voltage suppressor is designed for applications requiring  
transient overvoltage protection capability. It is intended for use in  
voltage and ESD sensitive equipment such as computers, printers,  
business machines, communication systems, medical equipment, and  
other applications. Its quad junction common anode design protects  
four separate lines using only one package. These devices are ideal for  
situations where board space is at a premium.  
http://onsemi.com  
1
2
3
6
5
4
Specification Features  
SC–88 Package Allows Four Separate Unidirectional Configurations  
Low Leakage < 1 mA @ 5 Volt  
Breakdown Voltage: 6.4 – 7.2 Volt @ 5 mA  
Low Capacitance (40 pF typical)  
ESD Protection Meeting 61000–4–2 Level 4  
MARKING  
DIAGRAM  
and 16 kV Human Body Model  
Mechanical Characteristics  
6
1
5
4
Void Free, Transfer–Molded, Thermosetting Plastic Case  
Corrosion Resistant Finish, Easily Solderable  
Package Designed for Optimal Automated Board Assembly  
Small Package Size for High Density Applications  
SC–88  
CASE 419B  
PLASTIC  
d
68  
2
3
68 = Device Marking  
d
= One Digit Date Code  
= Pin 1 Indicator  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
A
Rating  
Symbol  
Value  
Unit  
Peak Power Dissipation @ 8 x 20 ms  
P
pk  
75  
Watts  
(Note 1)  
ORDERING INFORMATION  
Steady State Power Dissipation  
(Note 2)  
P
D
385  
mW  
Device  
Package  
Shipping  
DF6A6.8FUT1  
SC–88  
3000/Tape & Reel  
Thermal Resistance –  
Junction to Ambient  
Derate Above 25°C  
R
q
JA  
328  
3.0  
°C/W  
mW/°C  
Maximum Junction Temperature  
T
150  
°C  
°C  
Jmax  
Operating Junction and Storage  
Temperature Range  
T , T  
J
–55 to  
+150  
stg  
ESD Discharge  
V
PP  
kV  
MIL STD 883C – Method 3015–6  
IEC61000–4–2, Air Discharge  
IEC61000–4–2, Contact Discharge  
16  
16  
8
Lead Solder Temperature  
(10 seconds duration)  
T
L
260  
°C  
1. Per Waveform Figure 1  
2. Mounted on FR–5 Board = 1.0 X 0.75 X 0.062 in.  
Semiconductor Components Industries, LLC, 2001  
1
Publication Order Number:  
May, 2001 – Rev. 0  
DF6A6.8FUT1/D  

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