Applicable standard
Operating
Storage
Temperature range
Storage
Humidity range
-55 ºC to +105 ºC (Note1)
20 % to 80 % (Note2)
DF63-5S-3.96C
-10 ºC to +60 ºC (Note3)
40 % to 70 % (Note3)
Temperature range
Operating
Humidity range
Applicable
Rating
Voltage
Current
AC/DC
630 V
Connector
AWG #16 : 12 A
AWG #18 : 11 A
AWG #20 : 9 A
AWG #22 : 8 A
IP-Degree
-
Rated Voltage
Rated Current
See above
Overvoltage Category
UL,C-UL
TÜV
600V AC/DC
300V AC/DC
-
See above
IP00
Ⅱ
Specifications
Item
Test method
Requirements
QT
AT
Construction
General examination
Visually and by measuring instrument.
Confirmed visually.
According to drawing.
X
X
X
X
Marking
Electric characteristics
Contact Resistance
Insulation resistance
Voltage proof
20 mV MAX, 1mA(DC or 1000 Hz).
500 V DC.
10 mΩ MAX.
X
X
X
-
-
-
1000 MΩ MIN.
1500 V AC for 1 min.
No flashover or breakdown.
Mechanical characteristics
Mechanical operation
50 times insertion and extraction.
1) Contact resistance: 20 mΩ MAX.
X
-
2) No damage, crack or looseness of parts.
Vibration
Shock
Frequency 10 to 55 Hz, single amplitude
0.75 mm, at 10 cycles for 3 direction.
1) No electrical discontinuity of 1 μs.
X
X
-
-
2) No damage, crack or looseness of parts.
490 m/s2 duration of pulse 11 ms at 3 times each for 1) No electrical discontinuity of 1 μs.
3 both axial directions.
2) No damage, crack or looseness of parts.
Environmental characteristics
Damp heat
(Steady state)
Exposed at 40±2 ºC , 90 to 95 %, 96 h.
(After leaving the room temperature for 1 to 2h.)
1) Contact resistance: 20 mΩ MAX.
2) Insulation resistance: 500 MΩ MIN.
3) No damage, crack or looseness of parts.
1) Contact resistance: 20 mΩ MAX.
2) Insulation resistance: 1000 MΩ MIN.
3) No damage, crack or looseness of parts.
X
X
-
-
Rapid change of
temperature
Temperature -55 ºC → +85 ºC
Time
30 min → 30 min
Under 5 cycles.
(The transferring time of the tank is 2 to 3 min)
(After leaving the room temperature for 1 to 2h.)
1)Solder bath method
Soldered at solder temperature
260 ºC for immersing duration 5 s.
2) Manual soldering
Resistance to
Soldering heat
Such as impaired function ,no deformation of
case of excessive looseness of the terminals.
3
X
X
-
-
3
Soldering iron tempreture: 300 ºC
Soldering time: 3 s
No strength on contact.
Solderability
Soldered at solder temperature
245 ºC for in immersing duration 5 s.
A new uniform coating of solder shall
cover minimum of 95 % of the surface
being immersed.
Note 1: Include the temperature rising by current.
Note 2: No condensing.
Note 3: Apply to the condition of long term storage for unused products before mounted on PCB.
After mounted on PCB, operation temperature and humidity range is applied for interim storage during transportation.
Count
Description of revisions
Designed
Checked
Date
3
△
2019120
2
DIS-H-00005520
TO.KUROMATSU
SZ.ONO
2
Remarks
KI.AKIYAMA
TS.FUKUSHIMA
YK.YAMAGUCHI
HK.HAYASHI
20151007
20151006
20151006
20151006
Approved
Checked
Designed
Drawn
Unless otherwise specified, refer to IEC 60512.
Note QT:Qualification Test AT:Assurance Test X:Applicable Test
Drawing No.
Part No.
ELC-362112-01-00
DF63-3P-7.92DSA(01)
Specification sheet
3
CL680-0537-0-01
△
1/1
HIROSE ELECTRIC CO., LTD.
Code No.
FORM HD0011-2-1