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DF61Y-2P-2.2V(23) PDF预览

DF61Y-2P-2.2V(23)

更新时间: 2024-11-22 18:09:27
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广濑 - HRS 连接器
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描述
连接器类型:插头;线束品:无;PIN数:2;额定电流:4.0 A;(AC)额定电压:AC 350.0 V;(DC)额定电压:DC 350.0 V;(嵌合部分)列数:1;安装间距:2.2 mm;开口

DF61Y-2P-2.2V(23) 数据手册

  
Applicable standard  
Operating  
Storage  
temperature range  
Storage  
-40 C to +105C (Note1)  
-10 C to +60C (Note3)  
temperature range  
Operating  
Rating  
20% to 80% (Note2)  
DF61Y-2S-2.2C  
40% to 70% (Note3)  
humidity range  
Applicable connector  
Voltage  
humidity range  
Current  
AWG 28 : 3.0A  
AWG 26 : 3.2A  
AWG 24 : 4.0A  
350  
V
AC/DC  
Specifications  
Test method  
Item  
Requirements  
QT AT  
Construction  
General examination  
Visually and by measuring instrument.  
Confirmed visually.  
According to drawing.  
X
X
X
X
Marking  
Electric characteristics  
Contact resistance  
millivolt level method  
Insulation resistance  
20mV MAX, 1mA (DC or 1000Hz).  
10 mMAX.  
X
500 V DC.  
1000 MMIN.  
X
X
1200 V AC for 1 MIN.  
No flashover or breakdown.  
Voltage proof  
Mechanical characteristics  
30 times insertion and extraction.  
Mechanical operation  
Contact resistance: 20 mMAX.  
X
X
No damage, crack or looseness of parts.  
It takes out and inserts with a conformity connector.  
Contact insertion  
and extraction forces  
Insertion force  
: 20.0N MAX.  
Extraction force: 0.5N MIN.  
Frequency 10 to 55 Hz, single amplitude  
0.75 mm, at 10 cycles for 3 direction.  
490 m/s2 duration of pulse 11 ms at 3 times for 3 directions.  
Vibration  
No electrical discontinuity of 1μs.  
No damage, crack or looseness of parts.  
X
X
Shock  
Environmental characteristics  
Damp heat  
(Steady state)  
Exposed at 40 ± 2, 90 to 95 %, 96 h.  
(after leaving the room temperature for  
1-2h.)  
Contact resistance: 20 mMAX.  
Insulation resistance: 500 MMIN.  
No damage, crack or looseness of parts.  
Contact resistance: 20 mMAX.  
Insulation resistance: 500 MMIN.  
No damage, crack or looseness of parts.  
X
X
Rapid change of temperature  
Resistance to soldering heat  
Temperature -55℃→ +85℃  
Time  
30MIN30MIN  
Under 5 cycles.  
(The transferring time of the tank is 2-3 MIN)  
(After leaving the room temperature for 1-2h.)  
1) Reflow soldering  
No deformation of case of  
excessive looseness of the  
terminals.  
X
Reflow time≫  
Number of reflow cycles : 2 cycles MAX.  
Duration above 220 , 60 sec. MAX.  
Peak temperature: 25010 sec. MAX.  
Pre-heat time≫  
Pre-heat temperature(MIN) :150 ℃  
Pre-heat temperature(MAX) :180 ℃  
Pre-heat time(MIN) : 90 sec.  
Pre-heat time(MAX) : 120 sec.  
2) Manual soldering  
Soldering iron temperature :350±10,  
Soldering time : 3sec.  
No strength on contact.  
Solderability  
Remarks  
Soldering temperature : 245c  
Duration of immersion :soldering, for 5 sec.  
New uniform coating of solder shall  
cover minimum of 95 of the surface being  
immersed.  
X
Note 1: Include the temperature rising by current.  
Note 2: No condensing  
Note 3:Apply to the condition of long term storage for unused products befor pcb on board,  
After pcb on board, operating temperature and humiditty range is applied for interim storage during transportation.  
Count  
Description of revisions  
Designed  
Checked  
Date  
0
1
Approved  
Checked  
Designed  
Drawn  
KI.AKIYAMA  
HK.UMEHARA  
ST.SATO  
15.06.11  
15.06.11  
15.06.11  
15.06.11  
Unless otherwise specifid , refer to IEC 60512.  
MI.SAKIMURA  
Note QT:Qualification Test AT:Assurance Test X:Applicable Test  
Drawing no.  
ELC-361873-23-00  
DF61Y-2P-2.2V(23)  
Part no.  
Specification sheet  
Hirose electric co., ltd.  
0
1/1  
Code no.  
CL666-5100-3-23  
FORM HD0011-2-1  

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