Datasheet > DF61Y-2P-2.2V(23)

DF61Y-2P-2.2V(23)

更新时间： 2024-09-30 18:09:27

品牌	Logo	应用领域
广濑 - HRS		连接器
页数	文件大小	规格书
1页	78K
描述
连接器类型:插头;线束品:无;PIN数:2;额定电流:4.0 A;(AC)额定电压:AC 350.0 V;(DC)额定电压:DC 350.0 V;(嵌合部分)列数:1;安装间距:2.2 mm;开口

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中文翻译

获取价格

数据手册

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DF61Y-2P-2.2V(23) 数据手册

Applicable standard

Operating

Storage

temperature range

Storage

-40 C to +105C (Note1)

-10 C to +60C (Note3)

temperature range

Operating

Rating

20% to 80% (Note2)

DF61Y-2S-2.2C

40% to 70% (Note3)

humidity range

Applicable connector

Voltage

humidity range

Current

AWG 28 : 3.0A

AWG 26 : 3.2A

AWG 24 : 4.0A

350

AC/DC

Specifications

Test method

Item

Requirements

QT AT

Construction

General examination

Visually and by measuring instrument.

Confirmed visually.

According to drawing.

Marking

Electric characteristics

Contact resistance

millivolt level method

Insulation resistance

20mV MAX, 1mA (DC or 1000Hz).

10 m MAX.

－

500 V DC.

1000 M MIN.

－

1200 V AC for 1 MIN.

No flashover or breakdown.

Voltage proof

Mechanical characteristics

30 times insertion and extraction.

Mechanical operation

①Contact resistance: 20 m MAX.

－

②No damage, crack or looseness of parts.

It takes out and inserts with a conformity connector.

Contact insertion

and extraction forces

①Insertion force

: 20.0N MAX.

②Extraction force: 0.5N MIN.

Frequency 10 to 55 Hz, single amplitude

0.75 mm, at 10 cycles for 3 direction.

490 m/s²duration of pulse 11 ms at 3 times for 3 directions.

Vibration

①No electrical discontinuity of 1μs.

②No damage, crack or looseness of parts.

－

Shock

Environmental characteristics

Damp heat

(Steady state)

Exposed at 40 ± 2℃ , 90 to 95 %, 96 h.

(after leaving the room temperature for

1-2h.)

①Contact resistance: 20 m MAX.

②Insulation resistance: 500 M MIN.

③No damage, crack or looseness of parts.

①Contact resistance: 20 m MAX.

②Insulation resistance: 500 M MIN.

③No damage, crack or looseness of parts.

－

Rapid change of temperature

Resistance to soldering heat

Temperature -55℃→ +85℃

Time

30MIN→ 30MIN

Under 5 cycles.

(The transferring time of the tank is 2-3 MIN)

(After leaving the room temperature for 1-2h.)

1) Reflow soldering

No deformation of case of

excessive looseness of the

terminals.

－

≪Reflow time≫

Number of reflow cycles : 2 cycles MAX.

Duration above 220 ℃, 60 sec. MAX.

Peak temperature: 250℃ 10 sec. MAX.

≪Pre-heat time≫

Pre-heat temperature(MIN) :150 ℃

Pre-heat temperature(MAX) :180 ℃

Pre-heat time(MIN) : 90 sec.

Pre-heat time(MAX) : 120 sec.

2) Manual soldering

Soldering iron temperature :350±10℃,

Soldering time : 3sec.

No strength on contact.

Solderability

Remarks

Soldering temperature : 245c

Duration of immersion :soldering, for 5 sec.

New uniform coating of solder shall

cover minimum of 95  of the surface being

immersed.

－

Note 1: Include the temperature rising by current.

Note 2: No condensing

Note 3:Apply to the condition of long term storage for unused products befor pcb on board,

After pcb on board, operating temperature and humiditty range is applied for interim storage during transportation.

Count

Description of revisions

Designed

Checked

Date

△

Approved

Checked

Designed

Drawn

KI.AKIYAMA

HK.UMEHARA

ST.SATO

15.06.11

Unless otherwise specifid , refer to IEC 60512.

MI.SAKIMURA

Note QT:Qualification Test AT:Assurance Test X:Applicable Test

Drawing no.

ELC-361873-23-00

DF61Y-2P-2.2V(23)

Part no.

Specification sheet

Hirose electric co., ltd.

△

1/1

Code no.

CL666-5100-3-23

FORM HD0011-2-1

中文翻译

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