Applicable standard
Operating
Storage
temperature range
Storage
-40 C to +105C (Note1)
-10 C to +60C (Note3)
temperature range
Operating
Rating
20% to 80% (Note2)
DF61Y-2S-2.2C
40% to 70% (Note3)
humidity range
Applicable connector
Voltage
humidity range
Current
AWG 28 : 3.0A
AWG 26 : 3.2A
AWG 24 : 4.0A
350
V
AC/DC
Specifications
Test method
Item
Requirements
QT AT
Construction
General examination
Visually and by measuring instrument.
Confirmed visually.
According to drawing.
X
X
X
X
Marking
Electric characteristics
Contact resistance
millivolt level method
Insulation resistance
20mV MAX, 1mA (DC or 1000Hz).
10 m MAX.
-
X
500 V DC.
1000 M MIN.
-
-
X
X
1200 V AC for 1 MIN.
No flashover or breakdown.
Voltage proof
Mechanical characteristics
30 times insertion and extraction.
Mechanical operation
①Contact resistance: 20 m MAX.
-
-
X
X
②No damage, crack or looseness of parts.
It takes out and inserts with a conformity connector.
Contact insertion
and extraction forces
①Insertion force
: 20.0N MAX.
②Extraction force: 0.5N MIN.
Frequency 10 to 55 Hz, single amplitude
0.75 mm, at 10 cycles for 3 direction.
490 m/s2 duration of pulse 11 ms at 3 times for 3 directions.
Vibration
①No electrical discontinuity of 1μs.
②No damage, crack or looseness of parts.
-
-
X
X
Shock
Environmental characteristics
Damp heat
(Steady state)
Exposed at 40 ± 2℃ , 90 to 95 %, 96 h.
(after leaving the room temperature for
1-2h.)
①Contact resistance: 20 m MAX.
②Insulation resistance: 500 M MIN.
③No damage, crack or looseness of parts.
①Contact resistance: 20 m MAX.
②Insulation resistance: 500 M MIN.
③No damage, crack or looseness of parts.
-
-
X
X
Rapid change of temperature
Resistance to soldering heat
Temperature -55℃→ +85℃
Time
30MIN→ 30MIN
Under 5 cycles.
(The transferring time of the tank is 2-3 MIN)
(After leaving the room temperature for 1-2h.)
1) Reflow soldering
No deformation of case of
excessive looseness of the
terminals.
-
X
≪Reflow time≫
Number of reflow cycles : 2 cycles MAX.
Duration above 220 ℃, 60 sec. MAX.
Peak temperature: 250℃ 10 sec. MAX.
≪Pre-heat time≫
Pre-heat temperature(MIN) :150 ℃
Pre-heat temperature(MAX) :180 ℃
Pre-heat time(MIN) : 90 sec.
Pre-heat time(MAX) : 120 sec.
2) Manual soldering
Soldering iron temperature :350±10℃,
Soldering time : 3sec.
No strength on contact.
Solderability
Remarks
Soldering temperature : 245c
Duration of immersion :soldering, for 5 sec.
New uniform coating of solder shall
cover minimum of 95 of the surface being
immersed.
-
X
Note 1: Include the temperature rising by current.
Note 2: No condensing
Note 3:Apply to the condition of long term storage for unused products befor pcb on board,
After pcb on board, operating temperature and humiditty range is applied for interim storage during transportation.
Count
Description of revisions
Designed
Checked
Date
0
△
1
Approved
Checked
Designed
Drawn
KI.AKIYAMA
HK.UMEHARA
ST.SATO
15.06.11
15.06.11
15.06.11
15.06.11
Unless otherwise specifid , refer to IEC 60512.
MI.SAKIMURA
Note QT:Qualification Test AT:Assurance Test X:Applicable Test
Drawing no.
ELC-361873-23-00
DF61Y-2P-2.2V(23)
Part no.
Specification sheet
Hirose electric co., ltd.
0
△
1/1
Code no.
CL666-5100-3-23
FORM HD0011-2-1