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DF51K-30SC(800) PDF预览

DF51K-30SC(800)

更新时间: 2024-12-01 18:09:55
品牌 Logo 应用领域
广濑 - HRS 连接器
页数 文件大小 规格书
1页 108K
描述
连接器类型:端子;线束品:无;额定电流:0.5 A;(AC)额定电压:AC 250.0 V;(DC)额定电压:DC 250.0 V;交错引线:无;插拔次数:30;接触部电镀:锡;电镀厚度:1.0

DF51K-30SC(800) 数据手册

  
COUNT  
COUNT  
DESCRIPTION OF REVISIONS  
DATE  
DESCRIPTION OF REVISIONS  
CHKD  
DATE  
BY CHKD  
BY  
APPLICABLE STANDARD  
Operating  
Storage  
-55℃ to +105℃ (Note1)  
20% to 80% (Note2)  
DF51K-*(D)S-2C (###)  
AWG#30  
-10℃ to +60℃ (Note3)  
40% to 70% (Note3)  
250V AC/DC  
Temperature Range  
Operating Humidity  
Range  
Temperature Range  
Storage Humidity  
Range  
RATING Applicable Connector  
Voltage  
Applicable Cable  
Current  
AWG 30 : 0.5A  
Insulation Diameter  
φ0.8 mm  
SPECIFICATIONS  
TEST METHOD  
ITEM  
CONSTRUCTION  
REQUIREMENTS  
QT AT  
General Examination  
Visually and by measuring instrument.  
Confirmed visually.  
O
O
O
O
According to drawing.  
Marking  
ELECTRICAL CHARACTERISTICS  
Contact Resistance  
20mV MAX, 1mA (DC or 1000Hz).  
30 mMAX.  
O
-
Millivolt Level Method  
MECHANICAL CHARACTERISTICS  
Mechanical Operation  
(Sn Plating)  
Mechanical Operation  
(Au Plating)  
30 times insertion and extraction.  
①Contact resistance: 30mMAX  
O
O
O
O
-
-
-
-
②No damage, crack or looseness of parts.  
①Contact resistance: 30mMAX  
50 times insertion and extraction.  
②No damage, crack or looseness of parts.  
Vibration  
Frequency 10 to 55 Hz, single amplitude 0.75 mm,  
at 10 cycles for 3 direction.  
①No electrical discontinuity of 1μs.  
②No damage, crack or looseness of parts.  
Acceleration 490 m/s2 duration of pulse 11 ms at 3  
times for 3 directions.  
Shock  
ENVIRONMENTAL CHARACTERISTICS  
Damp Heat  
Exposed at 40 ± 2 ℃ , humidity 90 to 95 %, 96 h.  
①Contact resistance: 30 mMAX.  
O
O
(Steady State) (After leaving the room temperature for 1 to 2h.)  
②No damage, crack or looseness of parts.  
-
-
Rapid Change of  
Temperature  
Temperatureꢀ-55 ℃→ +105 ℃  
①Contact resistance: 30 mMAX.  
Time  
30min→ 30min  
Under 5 Cycles. ②No damage, crack or looseness of parts.  
(The transferring time of the tank is 2 to 3 MIN)  
(After leaving the room temperature for 1 to 2h.)  
Remarks  
Note 1: Include the temperature rising by current.  
Note 2: No condensing  
Note 3: Apply to the condition of long term storage for unused products before pcb on board, after pcb board , operating temperature and  
humidity range is applied for interim storage during transportation.  
DRAWN  
DESIGNED  
CHECKED  
APPROVED  
RELEASED  
KIM. Y. H  
18.10.02  
KIM. Y. H  
18.10.02  
LIM. S. M  
18.10.02  
LIM. S. M  
18.10.02  
Unless otherwise specified, refer to IEC 60512.  
NOTE QT: QUALIFICATION TEST AT: ASSURANCE TEST O: APPLICABLE TEST  
PART NO.  
HIROSE KOREA CO.,LTD.  
SPECIFICATION SHEET  
DF51K-30SC (800)  
CL 6652-0067-0-800  
CODE NO.(OLD)  
DRAWING NO.  
CODE NO.  
1
ELC4-611514  
CL  
1
F-1-021(Rev.0)  

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