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DF13EA-40DP-1.25V(22) PDF预览

DF13EA-40DP-1.25V(22)

更新时间: 2024-11-09 18:09:27
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描述
连接器类型:插头;线束品:无;安全规格:UL;PIN数:40;额定电流:1.0 A;(AC)额定电压:AC 150.0 V;(DC)额定电压:DC 150.0 V;(嵌合部分)列数:2;安装间距:

DF13EA-40DP-1.25V(22) 数据手册

  
Applicable standard  
Operating  
Storage  
-35C to +85C(Notes 1)  
-10C to +60C(Note3)  
temperature range  
temperature range  
Storage  
Operating  
20 % to 80 % (Notes 2)  
40 % to 70 %(Note3)  
Rating  
humidity range  
humidity range  
150 V AC (DC)  
1
A/pin  
Voltage  
Current  
Applicable  
Applicable  
DF13(G)-2630SCF  
DF13-3032SCF  
DF13-*DS-1.25C  
Connector  
Contact  
Specifications  
Test method  
Item  
Requirements  
QT AT  
Construction  
General examination  
Visually and by measuring instrument.  
Confirmed visually.  
According to drawing.  
X
X
X
X
Marking  
Electric characteristics  
Contact resistance  
AC 20mV, 1mA (DC OR 1000 Hz).  
30 mMAX.  
500 MMIN.  
X
X
X
Insulation resistance  
100 V DC.  
Voltage proof  
500 V AC for 1 min.  
No flashover or breakdown.  
Mechanical characteristics  
Mechanical operation  
30 times insertions and extractions.  
1) Contact resistance: 30 mMAX.  
X
X
X
2) No damage, crack or looseness of parts.  
Vibration  
Frequency 10 to 55 Hz, single amplitude  
0.75 mm, at 2 h, for 3 directions.  
490 m/s2 duration of pulse 11 ms at 3 times for 3  
directions.  
1) No electrical discontinuity of 1s.  
2) No damage, crack or looseness of parts.  
Shock  
Environmental characteristics  
Rapid change of  
Temperature -55C+85C  
1) Contact resistance:  
30mMAX.  
temperature  
1
Time  
Under 5 Cycles.  
(The transferring time of the tank is 2 to 3 MIN)  
30min30min  
2) Insulation resistance: 500 MMIN.  
3) No damage, crack or looseness of parts.  
X
Damp heat  
Exposed at 40±2 C, 90 to 95 , 96 h.  
X
(Steady state)  
Resistance to soldering  
heat  
1) Reflow soldering  
No deformation of case of excessive looseness  
of the terminals.  
X
Reflow area≫  
250MAX  
230MIN  
10 sec MAX  
60 sec MAX  
Preheating area≫  
170to 19060 sec to 120 sec  
Put through in reflow furnace twice,  
leave in ambient temperature and humidity  
for 1 hour.  
2) Manual soldering  
Soldering iron temperature :300,  
Soldering time: 3sec.  
No strength on contact.  
Solderability  
Soldered at solder temperature,  
Solder shall cover a minimum of  
X
245c for insertion duration, 3sec.  
95 of the surface being immersed.  
Remarks  
Note 1: Include the temperature rising by current.  
Note 2: No condensing  
Note 3: Apply to the condition of long term storage for unused products before mounted on PCB.  
After mounted on PCB, operating temperature and humidity range is applied for interim storage during transportation.  
Count  
Description of revisions  
DIS-H-00009653  
Designed  
HT.SATO  
Checked  
SZ.ONO  
Date  
1
1
20210608  
20200313  
20200313  
20200313  
20200306  
Unless otherwise specified , refer to IEC 60512.  
Approved  
HS.OKAWA  
Checked  
Designed  
Drawn  
TS.KUMAZAWA  
HK.HAYASHI  
DS.HIROWATARI  
Note QT:Qualification Test AT:Assurance Test X:Applicable Test  
Drawing no.  
ELC-367982-22-00  
Part no.  
Code no.  
DF13EA-*DP-1.25V(22)  
Specification sheet  
Hirose electric co., ltd.  
1
1/1  
CL536  
FORM HD0011-2-1  

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