Datasheet > DF005M_2

DF005M_2

更新时间： 2022-10-26 18:36:44

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描述
1.0A GLASS PASSIVATED BRIDGE RECTIFIERS

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DF005M_2 数据手册

DF005M - DF10M

1.0A GLASS PASSIVATED BRIDGE RECTIFIERS

Features

•

Glass Passivated Die Construction

Low Forward Voltage Drop, High Current Capability

Surge Overload Rating to 50A Peak

Designed for Printed Circuit Board Applications

UL Listed Under Recognized Component Index, File

Number E94661

DF-M

Dim

Min

7.40

6.20

0.22

1.27

7.60

3.81

8.13

2.40

5.00

0.46

Max

7.90

6.50

0.30

2.03

8.90

4.69

8.51

3.40

5.20

0.58

B A

•

Lead Free Finish, RoHS Compliant (Date Code 0532+)

(Note 3)

Mechanical Data

•

Case: DF-M

Case Material: Molded Plastic. UL Flammability

Classification Rating 94V-0

Moisture Sensitivity: Level 1 per J-STD-020C

Terminals: Finish - Tin. Solder Plated Leads,

Solderable per MIL-STD-202, Method 208

Polarity: As Marked on Case

Marking Information: Type Number, See Page 3

Weight: 0.38 grams (approximate)

•

All Dimensions in mm

Maximum Ratings and Electrical Characteristics

@T_A= 25°C unless otherwise specified

Single phase, half wave, 60Hz, resistive or inductive load.

For capacitive load, derate current by 20%.

005M

01M

02M

04M

06M

08M

10M

Characteristic

Symbol

Unit

V_RMM

V_RWM

V_R

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage

DC Blocking Voltage

100

200

140

400

600

420

800

580

1000

700

RMS Reverse Voltage

280

1.0

V_RMS

I_O

I_FSM

V_FM

Average Rectified Output Current

@ T_A= 40°C

@ I_F= 1.0 A

Non-Repetitive Peak Forward Surge Current, 8.3 ms

Single Half Sine-Wave Superimposed on Rated Load

1.1

Forward Voltage (per element)

Peak Reverse Current

at Rated DC Blocking Voltage (per element)

I²t Rating for Fusing (t<8.3ms)

@ T_A= 25°C

@ T_A= 125°C

500

µA

A²s

I_RM

I²t

10.4

Typical Total Capacitance per element

Typical Thermal Resistance, Junction to Ambient

Operating and Storage Temperature Range

(Note 1)

(Note 2)

C_T

°C/W

°C

R_θ

-65 to +150

T_j, T_STG

Notes:

1. Measured at 1.0MHz and applied reverse voltage of 4.0V DC.

2. Thermal Resistance, junction to ambient, measured on PC board with 5.0mm²(0.03mm thick) land areas.

3. RοHS revision 13.2.2003. Glass and high temperature solder exemptions applied, see EU Directive Annex Notes 5 and 7.

DS21201 Rev. 15 - 2

DF005M-DF10M

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