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DDTC114YLP-7B PDF预览

DDTC114YLP-7B

更新时间： 2024-11-26 13:07:19
品牌 Logo 应用领域
美台 - DIODES 晶体小信号双极晶体管
页数 文件大小 规格书
7页 197K
描述
Small Signal Bipolar Transistor

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中文翻译

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DDTC114YLP-7B 技术参数

是否Rohs认证： 符合生命周期：Active
包装说明：CHIP CARRIER, R-PBCC-N3Reach Compliance Code：compliant
风险等级：5.65其他特性：BUILT IN BIAS RESISTANCE RATIO IS 4.7
外壳连接：COLLECTOR最大集电极电流 (IC)：0.1 A
集电极-发射极最大电压：50 V配置：SINGLE WITH BUILT-IN RESISTOR
最小直流电流增益 (hFE)：180JESD-30 代码：R-PBCC-N3
JESD-609代码：e4湿度敏感等级：1
元件数量：1端子数量：3
封装主体材料：PLASTIC/EPOXY封装形状：RECTANGULAR
封装形式：CHIP CARRIER峰值回流温度（摄氏度）：260
极性/信道类型：NPN表面贴装：YES
端子面层：Nickel/Palladium/Gold (Ni/Pd/Au)端子形式：NO LEAD
端子位置：BOTTOM处于峰值回流温度下的最长时间：30
晶体管元件材料：SILICON标称过渡频率 (fT)：250 MHz
Base Number Matches：1

DDTC114YLP-7B 数据手册

 浏览型号DDTC114YLP-7B的Datasheet PDF文件第2页浏览型号DDTC114YLP-7B的Datasheet PDF文件第3页浏览型号DDTC114YLP-7B的Datasheet PDF文件第4页浏览型号DDTC114YLP-7B的Datasheet PDF文件第5页浏览型号DDTC114YLP-7B的Datasheet PDF文件第6页浏览型号DDTC114YLP-7B的Datasheet PDF文件第7页 
DDTCxxxxLP (R1≠R2 Series)  
PRE-BIASED SMALL SIGNAL SURFACE MOUNT 100mA NPN TRANSISTOR  
Please click here to visit our online spice models database.  
Features  
Mechanical Data  
•
•
•
•
•
•
Epitaxial Planar Die Construction  
•
•
Case: DFN1006-3  
Case Material: Molded Plastic, "Green" Molding Compound.  
UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020D  
Terminal Connections: Collector Dot (See Diagram and  
Marking Information)  
Terminals: Finish ⎯ NiPdAu over Copper leadframe.  
Solderable per MIL-STD-202, Method 208  
Marking Information: See Page 6  
Ordering Information: See Page 6  
Weight: 0.0009 grams (approximate)  
Ultra-Small Leadless Surface Mount Package  
Ideally Suited for Automated Assembly Processes  
Lead Free By Design/RoHS Compliant (Note 1)  
"Green" Device (Note 2)  
•
•
Qualified to AEC-Q101 Standards for High Reliability  
•
Part Number  
DDTC123JLP  
DDTC143ZLP  
DDTC114YLP  
R1 (NOM)  
2.2K  
R2 (NOM)  
47K  
•
•
•
4.7K  
10K  
47K  
47K  
3
C
OUT  
C
B
1
B
2
3
IN  
3 OUT  
IN  
E
B
1
R1  
E
C
E
R2  
R1  
R2  
GND  
1
2
2
GND  
Package Pin Out  
Configuration  
Bottom View  
Device Schematics  
Maximum Ratings @TA = 25°C unless otherwise specified  
Characteristic  
Supply Voltage  
P/N  
Symbol  
VCC  
Value  
50  
Unit  
V
DDTC123JLP  
DDTC143ZLP  
DDTC114YLP  
DDTC123JLP  
DDTC143ZLP  
DDTC114YLP  
-5 to +12  
-5 to +30  
-5 to +40  
100  
100  
70  
Input Voltage  
V
VIN  
Output Voltage  
mA  
mA  
IO  
Maximum Collector Current  
100  
IC(MAX)  
Thermal Characteristics  
Characteristic  
Power Dissipation (Note 3)  
Symbol  
PD  
Pder  
Value  
250  
2
Unit  
mW  
Power Deration above 25 °C  
mW/°C  
Thermal Resistance, Junction to Ambient Air (Note 3)  
(Equivalent to one heated junction of NPN)  
500  
°C/W  
Rθ  
JA  
Operating and Storage Temperature Range  
-55 to +150  
TJ, TSTG  
°C  
Notes:  
1. No purposefully added lead.  
2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.  
3. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which  
can be found on page 6 or our website at http://www.diodes.com/datasheets/ap02001.pdf.  
1 of 7  
www.diodes.com  
March 2009  
© Diodes Incorporated  
DDTCxxxxLP (R1≠R2 Series)  
Document number: DS30755 Rev. 7 - 2  
1234567

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