Spec. No. : C303N3C
Issued Date : 2002.12.18
CYStech Electronics Corp.
Revised Date :
Page No. : 1/3
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DAN217N3
HIGH-SPEED SWITCHING DIODE
Description
The DAN217N3 consists of two diodes in a plastic surface mount package. The diodes are
connected in series and the unit is designed for high-speed switching application in hybrid thick
and thin-film circuits.
Features
• Small SMD Package (SOT-23)
• Ultra-high Speed
• Low Forward Voltage
• Fast Reverse Recovery Time
Absolute Maximum Ratings
• Maximum Temperatures
Storage Temperature............................................................................................ -65 ~ +150 °C
Junction Temperature.................................................................................................... +150 °C
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C)................................................................................ 250 mW
• Maximum Voltages and Currents (Ta=25°C)
Reverse Voltage .................................................................................................................. 70 V
Repetitive Reverse Voltage ................................................................................................. 70 V
Forward Current ............................................................................................................. 150 mA
Repetitive Forward Current ............................................................................................ 500 mA
Forward Surge Current (1ms)....................................................................................... 1000 mA
Characteristics (Ta=25°C)
Characteristic
Reverse Breakdown Voltage
Symbol
Condition
IR=100uA
Min
Max
-
Unit
V
V(BR)
VF(1)
VF(2)
VF(3)
VF(4)
IR
70
IF=1mA
-
715
855
1000
1250
2.5
mV
mV
mV
mV
uA
IF=10mA
IF=50mA
-
Forward Voltage
-
IF=150mA
-
Reverse Current
Total Capacitance
VR=70
-
CT
VR=0, f=1MHz
IF=IR=10mA, RL=100Ω
measured at IR=1mA
-
1.5
pF
Reverse Recovery Time
Trr
-
6
nS
DAN217N3
CYStek Product Specification