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DAC-08EP

更新时间: 2024-01-16 07:44:33
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20页 1190K
描述
DAC0800/DAC0802 8-Bit Digital-to-Analog Converters

DAC-08EP 数据手册

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DAC0800, DAC0802  
www.ti.com  
SNAS538C JUNE 1999REVISED FEBRUARY 2013  
DAC0800/DAC0802 8-Bit Digital-to-Analog Converters  
Check for Samples: DAC0800, DAC0802  
1
FEATURES  
DESCRIPTION  
The DAC0800 series are monolithic 8-bit high-speed  
2
Fast Settling Output Current: 100 ns  
Full Scale Error: ±1 LSB  
current-output digital-to-analog converters (DAC)  
featuring typical settling times of 100 ns. When used  
as a multiplying DAC, monotonic performance over a  
40 to 1 reference current range is possible. The  
DAC0800 series also features high compliance  
complementary current outputs to allow differential  
output voltages of 20 Vp-p with simple resistor loads.  
The reference-to-full-scale current matching of better  
than ±1 LSB eliminates the need for full-scale trims in  
most applications, while the nonlinearities of better  
than ±0.1% over temperature minimizes system error  
accumulations.  
Nonlinearity Over Temperature: ±0.1%  
Full Scale Current Drift: ±10 ppm/°C  
High Output Compliance: 10V to +18V  
Complementary Current Outputs  
Interface Directly with TTL, CMOS, PMOS and  
Others  
2 Quadrant Wide Range Multiplying Capability  
Wide Power Supply Range: ±4.5V to ±18V  
Low Power Consumption: 33 mW at ±5V  
Low Cost  
The noise immune inputs will accept a variety of logic  
levels. The performance and characteristics of the  
device are essentially unchanged over the ±4.5V to  
±18V power supply range and power consumption at  
only 33 mW with ±5V supplies is independent of logic  
input levels.  
The  
DAC0800,  
DAC0802,  
DAC0800C  
and  
DAC0802C are a direct replacement for the DAC-08,  
DAC-08A, DAC-08C, and DAC-08H, respectively. For  
single supply operation, refer to AN-1525.  
Typical Application  
Pin numbers represent the PDIP package. The SOIC package pin numbers differ from that of the PDIP package.  
Figure 1. ±20 VP-P Output Digital-to-Analog Converter  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
All trademarks are the property of their respective owners.  
2
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 1999–2013, Texas Instruments Incorporated  

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