D4SB10 ~ D4SB100
100 V ~ 1000 V
6.0 Amp High Current Glass Passivated
Molding Single-Phase Bridge Rectifier
Elektronische Bauelemente
RoHS Compliant Product
A suffix of “-C” specifies halogen-free and RoHS Compliant
D3-4SB
FEATURES
Plastic Package has Underwriters
Laboratory Flammability Classification 94V-0
This Series is UL listed under the Recognized Component index,
file number E231047
Single-in-line package
C
J
High current capacity with small package
Superior thermal conductivity
High temperature soldering guaranted:
260°C / 10 seconds
S
R
N
A
B
F
G
High IFSM
K
E
H
D
Q
L
P
L
L
Millimeter
Millimeter
REF.
REF.
Min.
Max.
25.3
15.3
4.62
18.0
Min.
2.50
7.30
Max.
2.90
7.70
A
B
C
D
24.7
14.7
4.58
17.0
K
L
N
3 X 45°
P
0.90
1.10
E
G
J
0.50
0.90
Q
R
S
H
1.50 REF.
4.50 REF.
3.00
0.8
3.40
1.2
3.50
9.3
3.90
9.7
F
3.0
4.0
MAXIMUM RATINGS (TA=25℃ unless otherwise noted)
PART NUMBERS
SYMBOL
UNITS
PARAMETERS
D4SB D4SB D4SB D4SB D4SB D4SB
10
20
40
60
80
100
100
200
400
600
800
1000
Maximum repetitive voltage
VRM
IR
V
10
@TA=25°C
@TA=125°C
@TC=100°C
Maximum DC reverse current at
rated DC blocking voltage
A
500
6 (1)
Average rectified forward
current 60Hz Sine wave
Resistance load
IO
A
A
2.8 (2)
@TA=25°C
Peak Forward Surge Current 10ms single half
sine-wave superimposed on rated load
IFSM
150
Maximum Instantaneous
Forward Voltage @ 3.0A
VF
1.1
2.5
V
Dielectric strength terminals to case,
AC 1 minute Current 1mA
Vdia
RθJA
KV
on P.C.B without heat-sink
Maximum thermal
22 (2)
°C / W
°C
Resistance per leg
on AI plate heat-sink
RθJC
3.4 (1)
Operating and Storage Temperature Range
TJ , TSTG
150 , -40 ~ 150
Notes:
(1) Unit case mounted on AI plate heat-sink
(2) Unites mounted on P.C.B. without heat-sink
(3) Recommended mounting position is to bolt down on heatsink with silicone thermal compound for maximum heat
transfer with #6 screw {heat-sink size:6.5 * 4.0 * 0.3cm}
http://www.SeCoSGmbH.com/
Any changes of specification will not be informed individually.
05-Aug-2010 Rev. A
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