Datasheet > CYW20706

CYW20706

更新时间： 2024-11-06 14:56:11

品牌	Logo	应用领域
英飞凌 - INFINEON		/
页数	文件大小	规格书
50页	797K
描述
The AIROC? CYW20706 Bluetooth? & Bluetooth??LE SoC is a Bluetooth? 5.2 core spec compliant device for IoT applications. Manufactured using the industry's advanced 40 nm CMOS low-power process, the CYW20706 employs high levels of integration to minimize external components, reducing the device footprint and the costs associated with implementing Bluetooth??solutions.

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CYW20706 数据手册

CYW20706

Bluetooth® SoC for embedded wireless

devices

General description

The Infineon CYW20706 is a single-chip Bluetooth® 5.2-compliant, stand-alone baseband processor with an

integrated 2.4 GHz transceiver. Manufactured using the industry’s most advanced 40 nm CMOS low-power

process, the CYW20706 employs the highest level of integration to eliminate all critical external components,

thereby minimizing the device’s footprint and the costs associated with implementing Bluetooth® solutions.

The CYW20706 is the optimal solution for embedded and IoT applications. Built-in firmware adheres to the

Bluetooth® Low Energy profile.

Infineon part numbering scheme

Infineon is converting the acquired IoT part numbers from Infineon to the Infineon part numbering scheme. Due

to this conversion, there is no change in form, fit, or function as a result of offering the device with Infineon part

number marking. The table provides Infineon ordering part number that matches an existing IoT part number.

Table 1

Mapping Table for Part Number between Broadcom and Infineon

Broadcom part number Infineon part number

BCM20706

CYW20706

BCM20706UA2KFFB4G

CYW20706UA2KFFB4G

Features

• Complies with Bluetooth® Core Specification version 5.2 including BR/EDR/Bluetooth® LE

• Bluetooth® Device ID profile version 1.3 compliant

• Supports Generic Access Profile (GAP)

• Supports Adaptive Frequency Hopping (AFH)

• Excellent receiver sensitivity

• Programmable output power control

• Integrated Arm® Cortex®-M3 microprocessor core

• On-chip power-on reset (POR)

• Support for EEPROM and serial flash interfaces

• Integrated low dropout regulators (LDO)

• On-chip software controlled PMU

• PCM/I²S Interface

• Infrared modulator

• On-chip support for SPI (master/slave modes)

• I2C interface (compatible with NXP I²C slaves)

• Package types:

- 49-pin FBGA package (4.5 mm × 4.0 mm) Bluetooth® 5.2-compliant

- RoHS compliant

Datasheet

www.infineon.com

Please read the Important Notice and Warnings at the end of this document

page 1

002-19479 Rev. *C

2023-02-17

12 3 4 5 6 7...50

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与CYW20706相关器件

型号	品牌	获取价格	描述	数据表
CYW20706UA1KFFB1G	CYPRESS	获取价格	Embedded Bluetooth 4.2 SoC with MCU, Bluetooth Transceiver, and Baseband Processor
CYW20707	CYPRESS	获取价格	Bluetooth SoC for Embedded Wireless Devices
CYW20707UA1KFFB1G	CYPRESS	获取价格	Complies with Bluetooth Core Specification version 4.2 including BR/EDR/BLE
CYW20707UA1KFFB4G	CYPRESS	获取价格	Complies with Bluetooth Core Specification version 4.2 including BR/EDR/BLE
CYW20707UA1KFFB4GT	CYPRESS	获取价格	Complies with Bluetooth Core Specification version 4.2 including BR/EDR/BLE
CYW20707UA2EKUBGT	CYPRESS	获取价格	Bluetooth SoC for Embedded Wireless Devices
CYW20707UA2KFFB4G	CYPRESS	获取价格	Complies with Bluetooth Core Specification version 4.2 including BR/EDR/BLE
CYW20707UA2KFFB4GT	CYPRESS	获取价格	Complies with Bluetooth Core Specification version 4.2 including BR/EDR/BLE
CYW20707VA1PKWBG	CYPRESS	获取价格	Complies with Bluetooth Core Specification version 4.2 including BR/EDR/BLE
CYW20707VA1PKWBGT	CYPRESS	获取价格	Complies with Bluetooth Core Specification version 4.2 including BR/EDR/BLE

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