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CYDMX256B16-65BVXI PDF预览

CYDMX256B16-65BVXI

更新时间: 2024-09-23 12:20:23
品牌 Logo 应用领域
赛普拉斯 - CYPRESS /
页数 文件大小 规格书
25页 691K
描述
16 K/8 K/4 K x 16 MoBL ADM 16 K/8 K/4 K x 16 MoBL ADM High speed access

CYDMX256B16-65BVXI 技术参数

是否Rohs认证: 符合生命周期:Active
零件包装代码:BGA包装说明:VFBGA, BGA100,10X10,20
针数:100Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.32.00.41
风险等级:5.68最长访问时间:65 ns
其他特性:IT CAN OPERATE ALSO 2.5 AND 3.3 VOLTI/O 类型:COMMON
JESD-30 代码:S-PBGA-B100JESD-609代码:e1
长度:6 mm内存密度:262144 bit
内存集成电路类型:DUAL-PORT SRAM内存宽度:16
湿度敏感等级:3功能数量:1
端口数量:2端子数量:100
字数:16384 words字数代码:16000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:16KX16
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:VFBGA封装等效代码:BGA100,10X10,20
封装形状:SQUARE封装形式:GRID ARRAY, VERY THIN PROFILE, FINE PITCH
并行/串行:PARALLEL峰值回流温度(摄氏度):260
电源:1.8/3 V认证状态:Not Qualified
座面最大高度:1 mm最大待机电流:0.000006 A
子类别:SRAMs最大压摆率:0.07 mA
最大供电电压 (Vsup):1.9 V最小供电电压 (Vsup):1.7 V
标称供电电压 (Vsup):1.8 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Tin/Silver/Copper (Sn/Ag/Cu)端子形式:BALL
端子节距:0.5 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:30宽度:6 mm
Base Number Matches:1

CYDMX256B16-65BVXI 数据手册

 浏览型号CYDMX256B16-65BVXI的Datasheet PDF文件第2页浏览型号CYDMX256B16-65BVXI的Datasheet PDF文件第3页浏览型号CYDMX256B16-65BVXI的Datasheet PDF文件第4页浏览型号CYDMX256B16-65BVXI的Datasheet PDF文件第5页浏览型号CYDMX256B16-65BVXI的Datasheet PDF文件第6页浏览型号CYDMX256B16-65BVXI的Datasheet PDF文件第7页 
CYDMX256A16, CYDMX256B16  
CYDMX128A16, CYDMX128B16  
CYDMX064A16, CYDMX064B16  
16 K/8 K/4 K × 16 MoBL® ADM  
Asynchronous Dual-Port Static RAM  
16 K/8 K/4  
K × 16 MoBL® ADM Asynchronous Dual-Port Static RAM  
Ultra low operating power  
Active: ICC = 15 mA (typical) at 90 ns  
Active: ICC = 25 mA (typical) at 65 ns  
Standby: ISB3 = 2 A (typical)  
Features  
True dual-ported memory block that allow simultaneous  
independent access  
One port with dedicated time multiplexed address and data  
(ADM) interface  
Port independent power down  
One port configurable to standard SRAM or time multiplexed  
address and data interface  
On-chip arbitration logic  
Mailbox interrupt for port to port communication  
Input Read and Output Drive registers  
Upper byte and lower byte control  
Small package: 6 × 6 mm, 100-ball Pb-free BGA  
Industrial temperature range  
16 K/8 K/4 K × 16 memory configuration  
High speed access  
65 ns or 90 ns ADM interface  
40 ns or 60 ns standard SRAM interface  
Fully asynchronous operation  
Port independent 1.8 V, 2.5 V, and 3.0 V IOs  
Block Diagram  
IRR1-IRR0 [note 2]  
ODR4-ODR0  
SFEN#  
IRR/ODR  
DataL<15..0>  
AddrL<13..0>  
DataR<15..0>  
I/OL15-I/OL8  
I/OL7-I/OL0  
I/OR15-I/OR8  
I/OR7-I/OR0  
Mux'ed  
Address /  
Data  
Mux'ed  
Address/  
Data  
Dual Ported  
Memory Array  
16k/8k/4k x 16  
ADV#L  
UB#L  
LB#L  
ADV#R  
UB#R  
LB#R  
AddrR<13..0>  
I/O Control  
I/O Control  
A13-A0 [note 1]  
MSEL  
Address  
Decode  
Address  
Decode  
CS#L  
OE#L  
WE#L  
CS#R  
OE#R  
WE#R  
Control Logic  
BUSY#L  
INT#L  
BUSY#R  
INT#R  
Notes  
1. A13-A0 for CYDMX256A16 and CYDMX256B16; A12-A0 for CYDMX128A16 and CYDMX128B16; and A11-A0 for CYDMX064A16 and CYDMX064B16.  
2. IRR1 and IRR2 not available for CYDMX256A16 and CYDMX256B16.  
Cypress Semiconductor Corporation  
Document #: 001-08090 Rev. *G  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised May 2, 2011  
[+] Feedback  

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