5秒后页面跳转
CYD36S72V18-133BGI PDF预览

CYD36S72V18-133BGI

更新时间: 2023-01-15 00:00:00
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器
页数 文件大小 规格书
52页 1093K
描述
Dual-Port SRAM, 512KX72, 13ns, CMOS, PBGA484, 27 X 27 MM, 2.33 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-484

CYD36S72V18-133BGI 数据手册

 浏览型号CYD36S72V18-133BGI的Datasheet PDF文件第2页浏览型号CYD36S72V18-133BGI的Datasheet PDF文件第3页浏览型号CYD36S72V18-133BGI的Datasheet PDF文件第4页浏览型号CYD36S72V18-133BGI的Datasheet PDF文件第5页浏览型号CYD36S72V18-133BGI的Datasheet PDF文件第6页浏览型号CYD36S72V18-133BGI的Datasheet PDF文件第7页 
FullFlex  
FullFlex™ Synchronous SDR Dual Port SRAM  
Features  
Functional Description  
True dual port memory enables simultaneous access to the  
shared array from each port  
The FullFlex™ dual port SRAM families consist of 2 Mbit, 4 Mbit,  
9 Mbit, 18 Mbit, and 36 Mbit synchronous, true dual port static  
RAMs that are high speed, low power 1.8V or 1.5V CMOS. Two  
ports are provided, enabling simultaneous access to the array.  
Simultaneous access to a location triggers deterministic access  
control. For FullFlex72 these ports operate independently with  
72-bit bus widths and each port is independently configured for  
two pipelined stages. Each port is also configured to operate in  
pipelined or flow through mode.  
Synchronous pipelined operation with Single Data Rate (SDR)  
operation on each port  
SDR interface at 200 MHz  
Up to 28.8 Gb/s bandwidth (200 MHz x 72 bit x 2 ports)  
Selectable pipelined or flow-through mode  
1.5V or 1.8V core power supply  
The advanced features include the following:  
Commercial and Industrial temperature  
IEEE 1149.1 JTAG boundary scan  
Built in deterministic access control to manage address colli-  
sions during simultaneous access tothesamememorylocation  
Variable Impedance Matching (VIM) to improve data trans-  
mission by matching the output driver impedance to the line  
impedance  
Available in 484-Ball PBGA (x72) and 256-Ball FBGA (x36 and  
x18) packages  
FullFlex72 family  
Echo clocks to improve data transfer  
36 Mbit: 512K x 72 (CYD36S72V18)  
18 Mbit: 256K x 72 (CYD18S72V18)  
9 Mbit: 128K x 72 (CYD09S72V18)  
4 Mbit: 64K x 72 (CYD04S72V18)  
To reduce the static power consumption, chip enables power  
down the internal circuitry. The number of latency cycles before  
a change in CE0 or CE1 enables or disables the databus  
matches the number of cycles of read latency selected for the  
device. For a valid write or read to occur, activate both chip  
enable inputs on a port.  
FullFlex36 family  
36 Mbit: 1M x 36 (CYD36S36V18)  
18 Mbit: 512K x 36 (CYD18S36V18)  
9 Mbit: 256K x 36 (CYD09S36V18)  
4 Mbit: 128K x 36 (CYD04S36V18)  
2 Mbit: 64K x 36 (CYD02S36V18)  
Each port contains an optional burst counter on the input address  
register. After externally loading the counter with the initial  
address, the counter increments the address internally.  
Additional device features include a mask register and a mirror  
register to control counter increments and wrap around. The  
counter interrupt (CNTINT) flags notify the host that the counter  
reaches maximum count value on the next clock cycle. The host  
reads the burst counter internal address, mask register address,  
and busy address on the address lines. The host also loads the  
counter with the address stored in the mirror register by using the  
retransmit functionality. Mailbox interrupt flags are used for  
message passing, and JTAG boundary scan and asynchronous  
Master Reset (MRST) are also available. The Logic Block  
Diagram on page 2 shows these features.  
FullFlex18 family  
36 Mbit: 2M x 18 (CYD36S18V18)  
18 Mbit: 1M x 18 (CYD18S18V18)  
9 Mbit: 512K x 18 (CYD09S18V18)  
4 Mbit: 256K x 18 (CYD04S18V18)  
Built in deterministic access control to manage address colli-  
sions  
Deterministic flag output upon collision detection  
Collision detection on back-to-back clock cycles  
First Busy Address readback  
The FullFlex72 is offered in a 484-Ball plastic BGA package. The  
FullFlex36 and FullFlex18 are available in 256-Ball fine pitch  
BGA package.  
Advanced features for improved high speed data transfer and  
flexibility  
Variable Impedance Matching (VIM)  
Echo clocks  
Selectable LVTTL (3.3V), Extended HSTL (1.4V–1.9V), 1.8V  
LVCMOS, or 2.5V LVCMOS IO on each port  
Burst counters for sequential memory access  
Mailbox with interrupt flags for message passing  
Dual Chip Enables for easy depth expansion  
Cypress Semiconductor Corporation  
Document Number: 38-06082 Rev. *H  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised May 15, 2008  
[+] Feedback  

与CYD36S72V18-133BGI相关器件

型号 品牌 描述 获取价格 数据表
CYD36S72V18-133BGXC CYPRESS Dual-Port SRAM, 512KX72, 13ns, CMOS, PBGA484, 27 X 27 MM, 2.33 MM HEIGHT, 1 MM PITCH, LEAD

获取价格

CYD36S72V18-133BGXI CYPRESS Dual-Port SRAM, 512KX72, 13ns, CMOS, PBGA484, 27 X 27 MM, 2.33 MM HEIGHT, 1 MM PITCH, LEAD

获取价格

CYD36S72V18-167BGXC CYPRESS Dual-Port SRAM, 512KX72, 11ns, CMOS, PBGA484, 27 X 27 MM, 2.33 MM HEIGHT, 1 MM PITCH, LEAD

获取价格

CYD36S72V18-167BGXI CYPRESS FullFlex Synchronous SDR Dual Port SRAM Commercial and Industrial temperature

获取价格

CYD36S72V18-167BGXI ROCHESTER 512KX72 DUAL-PORT SRAM, 4ns, PBGA484, 27 X 27 MM, 2.33 MM HEIGHT, 1 MM PITCH, LEAD FREE, P

获取价格

CYD36S72V18-200BGXC CYPRESS FullFlex Synchronous SDR Dual Port SRAM Commercial and Industrial temperature

获取价格