是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 |
针数: | 165 | Reach Compliance Code: | compliant |
ECCN代码: | 3A991.B.2.A | HTS代码: | 8542.32.00.41 |
风险等级: | 5.92 | 最长访问时间: | 0.33 ns |
其他特性: | PIPELINED ARCHITECTURE | JESD-30 代码: | R-PBGA-B165 |
长度: | 15 mm | 内存密度: | 67108864 bit |
内存集成电路类型: | DDR SRAM | 内存宽度: | 8 |
功能数量: | 1 | 端子数量: | 165 |
字数: | 8388608 words | 字数代码: | 8000000 |
工作模式: | SYNCHRONOUS | 最高工作温度: | 70 °C |
最低工作温度: | 组织: | 8MX8 | |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | LBGA |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, LOW PROFILE |
并行/串行: | PARALLEL | 认证状态: | Not Qualified |
座面最大高度: | 1.4 mm | 最大供电电压 (Vsup): | 1.9 V |
最小供电电压 (Vsup): | 1.7 V | 标称供电电压 (Vsup): | 1.8 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | COMMERCIAL | 端子形式: | BALL |
端子节距: | 1 mm | 端子位置: | BOTTOM |
宽度: | 13 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
CY7C1566KV18-500BZI | CYPRESS |
获取价格 |
72-Mbit DDR-II+ SRAM 2-Word Burst Architecture | |
CY7C1566KV18-500BZXC | CYPRESS |
获取价格 |
72-Mbit DDR-II+ SRAM 2-Word Burst Architecture | |
CY7C1566KV18-500BZXI | CYPRESS |
获取价格 |
72-Mbit DDR-II+ SRAM 2-Word Burst Architecture | |
CY7C1566KV18-550BZC | CYPRESS |
获取价格 |
72-Mbit DDR-II+ SRAM 2-Word Burst Architecture | |
CY7C1566KV18-550BZI | CYPRESS |
获取价格 |
72-Mbit DDR-II+ SRAM 2-Word Burst Architecture | |
CY7C1566KV18-550BZXC | CYPRESS |
获取价格 |
72-Mbit DDR-II+ SRAM 2-Word Burst Architecture | |
CY7C1566KV18-550BZXI | CYPRESS |
获取价格 |
72-Mbit DDR-II+ SRAM 2-Word Burst Architecture | |
CY7C1566V18 | CYPRESS |
获取价格 |
72-Mbit DDR-II+ SRAM 2-Word Burst Architecture (2.5 Cycle Read Latency) | |
CY7C1566V18_08 | CYPRESS |
获取价格 |
72-Mbit DDR-II+ SRAM 2-Word Burst Architecture (2.5 Cycle Read Latency) | |
CY7C1566V18-300BZC | CYPRESS |
获取价格 |
72-Mbit DDR-II+ SRAM 2-Word Burst Architecture (2.5 Cycle Read Latency) |