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CY7C1529JV18 PDF预览

CY7C1529JV18

更新时间: 2024-11-20 06:51:47
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赛普拉斯 - CYPRESS 静态存储器双倍数据速率
页数 文件大小 规格书
27页 643K
描述
72-Mbit DDR-II SIO SRAM 2-Word Burst Architecture

CY7C1529JV18 数据手册

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CY7C1522JV18, CY7C1529JV18  
CY7C1523JV18, CY7C1524JV18  
72-Mbit DDR-II SIO SRAM 2-Word  
Burst Architecture  
Features  
Functional Description  
72 Mbit Density (8M x 8, 8M x 9, 4M x 18, 2M x 36)  
300 MHz Clock for High Bandwidth  
The CY7C1522JV18, CY7C1529JV18, CY7C1523JV18, and  
CY7C1524JV18 are 1.8V Synchronous Pipelined SRAMs,  
equipped with Double Data Rate Separate I/O (DDR-II SIO)  
architecture. The DDR-II SIO consists of two separate ports: the  
read port and the write port to access the memory array. The  
read port has data outputs to support read operations and the  
write port has data inputs to support write operations. The DDR-II  
SIO has separate data inputs and data outputs to eliminate the  
need to ‘turnaround’ the data bus required with common I/O  
devices. Access to each port is accomplished through a common  
address bus. Addresses for read and write are latched on  
alternate rising edges of the input (K) clock. Write data is regis-  
tered on the rising edges of both K and K. Read data is driven on  
the rising edges of C and C if provided, or on the rising edge of  
K and K if C/C are not provided. Each address location is  
associated with two 8-bit words in the case of CY7C1522JV18,  
two 9-bit words in the case of CY7C1529JV18, two 18-bit words  
in the case of CY7C1523JV18, and two 36-bit words in the case  
of CY7C1524JV18 that burst sequentially into or out of the  
device.  
2-word Burst for reducing Address Bus Frequency  
Double Data Rate (DDR) Interfaces  
(data transferred at 600 MHz) at 300 MHz  
Two Input Clocks (K and K) for precise DDR timing  
SRAM uses rising edges only  
Two Input Clocks for output data (C and C) to minimize Clock  
Skew and Flight Time mismatches  
EchoClocks(CQandCQ)SimplifyDataCaptureinHighSpeed  
Systems  
Synchronous Internally Self-timed Writes  
DDR-II operates with 1.5 Cycle Read Latency when the Delay  
Lock Loop (DLL) is enabled  
Operates similar to a DDR-I device with 1 Cycle Read Latency  
in DLL Off Mode  
1.8V Core Power Supply with HSTL inputs and outputs  
Variable drive HSTL Output Buffers  
Asynchronous inputs include an output impedance matching  
input (ZQ). Synchronous data outputs are tightly matched to the  
two output echo clocks CQ/CQ, eliminating the need to capture  
data separately from each individual DDR-II SIO SRAM in the  
system design. Output data clocks (C/C) enable maximum  
system clocking and data synchronization flexibility.  
Expanded HSTL Output Voltage (1.4V–VDD  
)
Available in 165-Ball FBGA Package (15 x 17 x 1.4 mm)  
Offered in both Pb-free and non Pb-free packages  
JTAG 1149.1 Compatible Test Access Port  
All synchronous inputs pass through input registers controlled by  
the K or K input clocks. All data outputs pass through output  
registers controlled by the C or C (or K or K in a single clock  
domain) input clocks. Writes are conducted with on-chip  
synchronous self-timed write circuitry.  
Delay Lock Loop (DLL) for Accurate Data Placement  
Configurations  
CY7C1522JV18 – 8M x 8  
CY7C1529JV18 – 8M x 9  
CY7C1523JV18 – 4M x 18  
CY7C1524JV18 – 2M x 36  
Selection Guide  
Description  
300 MHz  
300  
250 MHz  
250  
Unit  
MHz  
mA  
Maximum Operating Frequency  
Maximum Operating Current  
x8  
x9  
900  
800  
900  
800  
x18  
x36  
950  
800  
1080  
900  
Cypress Semiconductor Corporation  
Document #: 001-44700 Rev. *B  
198 Champion Court  
San Jose  
,
CA 95134-1709  
408-943-2600  
Revised July 31, 2009  
[+] Feedback  

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