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CY7C1517V18-278BZXC PDF预览

CY7C1517V18-278BZXC

更新时间: 2024-11-24 05:19:47
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赛普拉斯 - CYPRESS 静态存储器双倍数据速率
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描述
72-Mbit DDR-II SRAM 4-Word Burst Architecture

CY7C1517V18-278BZXC 数据手册

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CY7C1517V18  
CY7C1528V18  
CY7C1519V18  
CY7C1521V18  
72-Mbit DDR-II SRAM 4-Word Burst  
Architecture  
Features  
Functional Description  
• 72-Mbit density (8M x 8, 8M x 9, 4M x 18, 2M x 36)  
• 300-MHz clock for high bandwidth  
The CY7C1517V18, CY7C1528V18, CY7C1519V18 and  
CY7C1521V18 are 1.8V Synchronous Pipelined SRAM  
equipped with DDR-II (Double Data Rate) architecture. The  
DDR-II consists of an SRAM core with advanced synchronous  
peripheral circuitry and a two-bit burst counter. Addresses for  
Read and Write are latched on alternate rising edges of the  
input (K) clock. Write data is registered on the rising edges of  
both K and K. Read data is driven on the rising edges of C and  
C if provided, or on the rising edge of K and K if C/C are not  
provided. Each address location is associated with four 8-bit  
words in the case of CY7C1517V18 and four 9-bit words in the  
case of CY7C1528V18 that burst sequentially into or out of the  
device. The burst counter always starts with “00” internally in  
the case of CY7C1517V18 and CY7C1528V18. On  
CY7C1519V18 and CY7C1521V18, the burst counter takes in  
the last two significant bits of the external address and bursts  
four 18-bit words in the case of CY7C1519V18, and four 36-bit  
words in the case of CY7C1521V18, sequentially into or out of  
the device.  
• 4-Word burst for reducing address bus frequency  
• Double Data Rate (DDR) interfaces  
(data transferred at 600 MHz) @ 300 MHz  
• Two input clocks (K and K) for precise DDR timing  
— SRAM uses rising edges only  
• Two input clocks for output data (C and C) to minimize  
clock-skew and flight-time mismatches  
• Echo clocks (CQ and CQ) simplify data capture in  
high-speed systems  
• Synchronous internally self-timed writes  
• 1.8V core power supply with HSTL inputs and outputs  
• Variable drive HSTL output buffers  
• Expanded HSTL output voltage (1.4V–VDD  
)
Asynchronous inputs include output impedance matching  
input (ZQ). Synchronous data outputs (Q, sharing the same  
physical pins as the data inputs, D) are tightly matched to the  
two output echo clocks CQ/CQ, eliminating the need for  
separately capturing data from each individual DDR-II SRAM  
in the system design.Output data clocks (C/C) enable  
maximum system clocking and data synchronization flexibility.  
• Available in 165-ball FBGA package (15 x 17 x 1.4 mm)  
• Offered in lead-free and non lead-free packages  
• JTAG 1149.1 compatible test access port  
• Delay Lock Loop (DLL) for accurate data placement  
Configurations  
All Synchronous Input Pass through input registers controlled  
CY7C1517V18 – 8M x 8  
CY7C1528V18 – 8M x 9  
CY7C1519V18 – 4M x 18  
CY7C1521V18 – 2M x 36  
All data outputs pass through output  
registers controlled by the C or C (or K or K in a single clock  
by the K or K input clocks.  
domain) input clocks Writes are conducted with on-chip  
.
synchronous self-timed write circuitry.  
Selection Guide  
300 MHz  
300  
278 MHz  
250 MHz  
250  
200 MHz  
200  
167 MHz  
167  
Unit  
MHz  
mA  
Maximum Operating Frequency  
Maximum Operating Current  
278  
900  
950  
850  
750  
700  
Cypress Semiconductor Corporation  
Document #: 38-05565 Rev. *E  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised September 25, 2006  

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