Datasheet > 存储 > SRAM> CY7C1513JV18-250BZXC

CY7C1513JV18-250BZXC

更新时间： 2024-11-01 06:51:43

品牌	Logo	应用领域
赛普拉斯 - CYPRESS		静态存储器
页数	文件大小	规格书
29页	682K
描述
72-Mbit QDR-II SRAM 4-Word Burst Architecture

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CY7C1513JV18-250BZXC 技术参数

是否Rohs认证：	符合	生命周期：	Obsolete
零件包装代码：	BGA	包装说明：	15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165
针数：	165	Reach Compliance Code：	unknown
ECCN代码：	3A991.B.2.A	HTS代码：	8542.32.00.41
Factory Lead Time：	1 week	风险等级：	5.77
最长访问时间：	0.45 ns	其他特性：	PIPELINED ARCHITECTURE
JESD-30 代码：	R-PBGA-B165	长度：	17 mm
内存密度：	75497472 bit	内存集成电路类型：	QDR SRAM
内存宽度：	18	湿度敏感等级：	3
功能数量：	1	端子数量：	165
字数：	4194304 words	字数代码：	4000000
工作模式：	SYNCHRONOUS	最高工作温度：	70 °C
最低工作温度：		组织：	4MX18
封装主体材料：	PLASTIC/EPOXY	封装代码：	LBGA
封装形状：	RECTANGULAR	封装形式：	GRID ARRAY, LOW PROFILE
并行/串行：	PARALLEL	峰值回流温度（摄氏度）：	260
认证状态：	Not Qualified	座面最大高度：	1.4 mm
最大供电电压 (Vsup)：	1.9 V	最小供电电压 (Vsup)：	1.7 V
标称供电电压 (Vsup)：	1.8 V	表面贴装：	YES
技术：	CMOS	温度等级：	COMMERCIAL
端子形式：	BALL	端子节距：	1 mm
端子位置：	BOTTOM	处于峰值回流温度下的最长时间：	NOT SPECIFIED
宽度：	15 mm	Base Number Matches：	1

CY7C1513JV18-250BZXC 数据手册

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CY7C1511JV18, CY7C1526JV18

CY7C1513JV18, CY7C1515JV18

72-Mbit QDR™-II SRAM 4-Word

Burst Architecture

Features

Configurations

■

Separate independent read and write data ports

Supports concurrent transactions

CY7C1511JV18 – 8M x 8

CY7C1526JV18 – 8M x 9

CY7C1513JV18 – 4M x 18

CY7C1515JV18 – 2M x 36

❐

■

300 MHz clock for high bandwidth

4-word burst for reducing address bus frequency

DoubleDataRate(DDR)interfacesonbothreadandwriteports

(data transferred at 600 MHz) at 300 MHz

Functional Description

The CY7C1511JV18, CY7C1526JV18, CY7C1513JV18, and

CY7C1515JV18 are 1.8V Synchronous Pipelined SRAMs,

equipped with QDR-II architecture. QDR-II architecture consists

of two separate ports: the read port and the write port to access

the memory array. The read port has dedicated data outputs to

support read operations and the write port has dedicated data

inputs to support write operations. QDR-II architecture has

separate data inputs and data outputs to completely eliminate

the need to “turn-around” the data bus that exists with common

IO devices. Each port is accessed through a common address

bus. Addresses for read and write addresses are latched on

alternate rising edges of the input (K) clock. Accesses to the

QDR-II read and write ports are completely independent of one

another. To maximize data throughput, both read and write ports

are equipped with DDR interfaces. Each address location is

associated with four 8-bit words (CY7C1511JV18), 9-bit words

(CY7C1526JV18), 18-bit words (CY7C1513JV18), or 36-bit

words (CY7C1515JV18) that burst sequentially into or out of the

device. Because data is transferred into and out of the device on

every rising edge of both input clocks (K and K and C and C),

memory bandwidth is maximized while simplifying system

design by eliminating bus “turn-arounds”.

■

Two input clocks (K and K) for precise DDR timing

❐

SRAM uses rising edges only

Two input clocks for output data (C and C) to minimize clock

skew and flight time mismatches

Echo clocks (CQ and CQ) simplify data capture in high speed

systems

Single multiplexed address input bus latches address inputs

for read and write ports

■

Separate port selects for depth expansion

Synchronous internally self-timed writes

QDR-II operates with 1.5 cycle read latency when the Delay

Lock Loop (DLL) is enabled

■

Operates similar to a QDR-I device with 1 cycle read latency

in DLL off mode

■

Available in x8, x9, x18, and x36 configurations

Full data coherency, providing most current data

Core V_DD= 1.8 (± 0.1V); IO V_DDQ= 1.4V to V_DD

Available in 165-ball FBGA package (15 x 17 x 1.4 mm)

Offered in both Pb-free and non Pb-free packages

Variable drive HSTL output buffers

Depth expansion is accomplished with port selects, which

enables each port to operate independently.

All synchronous inputs pass through input registers controlled by

the K or K input clocks. All data outputs pass through output

registers controlled by the C or C (or K or K in a single clock

domain) input clocks. Writes are conducted with on-chip

synchronous self-timed write circuitry.

JTAG 1149.1 compatible test access port

Delay Lock Loop (DLL) for accurate data placement

Selection Guide

Description

300 MHz

300

250 MHz

250

167 MHz

167

Unit

MHz

Maximum Operating Frequency

Maximum Operating Current

1090

1115

790

570

795

575

x18

x36

865

615

1140

1040

725

Cypress Semiconductor Corporation

Document Number: 001-12560 Rev. *E

•

198 Champion Court

•

San Jose

CA 95134-1709

•

408-943-2600

Revised July 31, 2009

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与CY7C1513JV18-250BZXC相关器件

型号	品牌	获取价格	描述	数据表
CY7C1513JV18-250BZXI	CYPRESS	获取价格	72-Mbit QDR-II SRAM 4-Word Burst Architecture
CY7C1513JV18-300BZC	CYPRESS	获取价格	72-Mbit QDR-II SRAM 4-Word Burst Architecture
CY7C1513JV18-300BZI	CYPRESS	获取价格	72-Mbit QDR-II SRAM 4-Word Burst Architecture
CY7C1513JV18-300BZXC	CYPRESS	获取价格	72-Mbit QDR-II SRAM 4-Word Burst Architecture
CY7C1513JV18-300BZXI	CYPRESS	获取价格	72-Mbit QDR-II SRAM 4-Word Burst Architecture
CY7C1513KV18	CYPRESS	获取价格	72-Mbit QDR II SRAM 4-Word Burst Architecture
CY7C1513KV18-200BZC	CYPRESS	获取价格	72-Mbit QDR II SRAM 4-Word Burst Architecture
CY7C1513KV18-200BZI	CYPRESS	获取价格	72-Mbit QDR II SRAM 4-Word Burst Architecture
CY7C1513KV18-200BZXC	CYPRESS	获取价格	72-Mbit QDR II SRAM 4-Word Burst Architecture
CY7C1513KV18-200BZXI	CYPRESS	获取价格	72-Mbit QDR II SRAM 4-Word Burst Architecture

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