Datasheet > 存储 > SRAM> CY7C1513JV18-167BZC

CY7C1513JV18-167BZC

更新时间： 2024-10-31 06:51:43

品牌	Logo	应用领域
赛普拉斯 - CYPRESS		存储内存集成电路静态存储器时钟
页数	文件大小	规格书
29页	682K
描述
72-Mbit QDR-II SRAM 4-Word Burst Architecture

阅读下载

中文翻译

获取价格

技术参数
数据手册

如果您发现信息不准确，欢迎纠错

CY7C1513JV18-167BZC 技术参数

是否Rohs认证：	不符合	生命周期：	Obsolete
零件包装代码：	BGA	包装说明：	15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
针数：	165	Reach Compliance Code：	compliant
ECCN代码：	3A991.B.2.A	HTS代码：	8542.32.00.41
风险等级：	5.88	Is Samacsys：	N
最长访问时间：	0.5 ns	最大时钟频率 (fCLK)：	167 MHz
I/O 类型：	SEPARATE	JESD-30 代码：	R-PBGA-B165
JESD-609代码：	e0	长度：	17 mm
内存密度：	75497472 bit	内存集成电路类型：	QDR SRAM
内存宽度：	18	功能数量：	1
端子数量：	165	字数：	4194304 words
字数代码：	4000000	工作模式：	SYNCHRONOUS
最高工作温度：	70 °C	最低工作温度：
组织：	4MX18	输出特性：	3-STATE
封装主体材料：	PLASTIC/EPOXY	封装代码：	LBGA
封装等效代码：	BGA165,11X15,40	封装形状：	RECTANGULAR
封装形式：	GRID ARRAY, LOW PROFILE	并行/串行：	PARALLEL
峰值回流温度（摄氏度）：	225	电源：	1.5/1.8,1.8 V
认证状态：	Not Qualified	座面最大高度：	1.4 mm
最小待机电流：	1.7 V	子类别：	SRAMs
最大压摆率：	0.615 mA	最大供电电压 (Vsup)：	1.9 V
最小供电电压 (Vsup)：	1.7 V	标称供电电压 (Vsup)：	1.8 V
表面贴装：	YES	技术：	CMOS
温度等级：	COMMERCIAL	端子面层：	Tin/Lead/Silver (Sn/Pb/Ag)
端子形式：	BALL	端子节距：	1 mm
端子位置：	BOTTOM	处于峰值回流温度下的最长时间：	30
宽度：	15 mm	Base Number Matches：	1

CY7C1513JV18-167BZC 数据手册

浏览型号CY7C1513JV18-167BZC的Datasheet PDF文件第2页

浏览型号CY7C1513JV18-167BZC的Datasheet PDF文件第3页

浏览型号CY7C1513JV18-167BZC的Datasheet PDF文件第4页

浏览型号CY7C1513JV18-167BZC的Datasheet PDF文件第5页

浏览型号CY7C1513JV18-167BZC的Datasheet PDF文件第6页

浏览型号CY7C1513JV18-167BZC的Datasheet PDF文件第7页

CY7C1511JV18, CY7C1526JV18

CY7C1513JV18, CY7C1515JV18

72-Mbit QDR™-II SRAM 4-Word

Burst Architecture

Features

Configurations

■

Separate independent read and write data ports

Supports concurrent transactions

CY7C1511JV18 – 8M x 8

CY7C1526JV18 – 8M x 9

CY7C1513JV18 – 4M x 18

CY7C1515JV18 – 2M x 36

❐

■

300 MHz clock for high bandwidth

4-word burst for reducing address bus frequency

DoubleDataRate(DDR)interfacesonbothreadandwriteports

(data transferred at 600 MHz) at 300 MHz

Functional Description

The CY7C1511JV18, CY7C1526JV18, CY7C1513JV18, and

CY7C1515JV18 are 1.8V Synchronous Pipelined SRAMs,

equipped with QDR-II architecture. QDR-II architecture consists

of two separate ports: the read port and the write port to access

the memory array. The read port has dedicated data outputs to

support read operations and the write port has dedicated data

inputs to support write operations. QDR-II architecture has

separate data inputs and data outputs to completely eliminate

the need to “turn-around” the data bus that exists with common

IO devices. Each port is accessed through a common address

bus. Addresses for read and write addresses are latched on

alternate rising edges of the input (K) clock. Accesses to the

QDR-II read and write ports are completely independent of one

another. To maximize data throughput, both read and write ports

are equipped with DDR interfaces. Each address location is

associated with four 8-bit words (CY7C1511JV18), 9-bit words

(CY7C1526JV18), 18-bit words (CY7C1513JV18), or 36-bit

words (CY7C1515JV18) that burst sequentially into or out of the

device. Because data is transferred into and out of the device on

every rising edge of both input clocks (K and K and C and C),

memory bandwidth is maximized while simplifying system

design by eliminating bus “turn-arounds”.

■

Two input clocks (K and K) for precise DDR timing

❐

SRAM uses rising edges only

Two input clocks for output data (C and C) to minimize clock

skew and flight time mismatches

Echo clocks (CQ and CQ) simplify data capture in high speed

systems

Single multiplexed address input bus latches address inputs

for read and write ports

■

Separate port selects for depth expansion

Synchronous internally self-timed writes

QDR-II operates with 1.5 cycle read latency when the Delay

Lock Loop (DLL) is enabled

■

Operates similar to a QDR-I device with 1 cycle read latency

in DLL off mode

■

Available in x8, x9, x18, and x36 configurations

Full data coherency, providing most current data

Core V_DD= 1.8 (± 0.1V); IO V_DDQ= 1.4V to V_DD

Available in 165-ball FBGA package (15 x 17 x 1.4 mm)

Offered in both Pb-free and non Pb-free packages

Variable drive HSTL output buffers

Depth expansion is accomplished with port selects, which

enables each port to operate independently.

All synchronous inputs pass through input registers controlled by

the K or K input clocks. All data outputs pass through output

registers controlled by the C or C (or K or K in a single clock

domain) input clocks. Writes are conducted with on-chip

synchronous self-timed write circuitry.

JTAG 1149.1 compatible test access port

Delay Lock Loop (DLL) for accurate data placement

Selection Guide

Description

300 MHz

300

250 MHz

250

167 MHz

167

Unit

MHz

Maximum Operating Frequency

Maximum Operating Current

1090

1115

790

570

795

575

x18

x36

865

615

1140

1040

725

Cypress Semiconductor Corporation

Document Number: 001-12560 Rev. *E

•

198 Champion Court

•

San Jose

CA 95134-1709

•

408-943-2600

Revised July 31, 2009

[+] Feedback

12 3 4 5 6 7...29

中文翻译

下载PDF

与CY7C1513JV18-167BZC相关器件

型号	品牌	获取价格	描述	数据表
CY7C1513JV18-167BZI	CYPRESS	获取价格	72-Mbit QDR-II SRAM 4-Word Burst Architecture
CY7C1513JV18-167BZXC	CYPRESS	获取价格	72-Mbit QDR-II SRAM 4-Word Burst Architecture
CY7C1513JV18-167BZXI	CYPRESS	获取价格	72-Mbit QDR-II SRAM 4-Word Burst Architecture
CY7C1513JV18-250BZC	CYPRESS	获取价格	72-Mbit QDR-II SRAM 4-Word Burst Architecture
CY7C1513JV18-250BZI	CYPRESS	获取价格	72-Mbit QDR-II SRAM 4-Word Burst Architecture
CY7C1513JV18-250BZXC	CYPRESS	获取价格	72-Mbit QDR-II SRAM 4-Word Burst Architecture
CY7C1513JV18-250BZXI	CYPRESS	获取价格	72-Mbit QDR-II SRAM 4-Word Burst Architecture
CY7C1513JV18-300BZC	CYPRESS	获取价格	72-Mbit QDR-II SRAM 4-Word Burst Architecture
CY7C1513JV18-300BZI	CYPRESS	获取价格	72-Mbit QDR-II SRAM 4-Word Burst Architecture
CY7C1513JV18-300BZXC	CYPRESS	获取价格	72-Mbit QDR-II SRAM 4-Word Burst Architecture

与CY7C1513JV18-167BZC相关文章

三星深化印度制造布局，供应链本地化进程加速
2024-10-29

20
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
2024-10-29

21
纳微科技震撼发布GaNSlim革新氮化镓功率芯片
2024-10-18

45
意法半导体发布第四代SiC技术，助力电动汽车电驱
2024-10-15

53

产品中心

服务支持

精选活动

关于我们

帮助中心

CY7C1513JV18-167BZC

CY7C1513JV18-167BZC 技术参数

CY7C1513JV18-167BZC 数据手册

与CY7C1513JV18-167BZC相关器件

与CY7C1513JV18-167BZC相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

CY7C1513JV18-167BZC

CY7C1513JV18-167BZC 技术参数

CY7C1513JV18-167BZC 数据手册

与CY7C1513JV18-167BZC相关器件

与CY7C1513JV18-167BZC相关文章

您还可以找

您在本页遇到什么问题？