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CY7C1482BV25-200AXC PDF预览

CY7C1482BV25-200AXC

更新时间: 2024-09-18 05:19:43
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 存储内存集成电路静态存储器时钟
页数 文件大小 规格书
31页 933K
描述
72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined Sync SRAM

CY7C1482BV25-200AXC 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:QFP包装说明:QFF, QFP100,.63X.87
针数:100Reach Compliance Code:compliant
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.84Is Samacsys:N
最长访问时间:3 ns最大时钟频率 (fCLK):200 MHz
I/O 类型:COMMONJESD-30 代码:R-PQFP-F100
JESD-609代码:e3长度:20 mm
内存密度:75497472 bit内存集成电路类型:CACHE SRAM
内存宽度:18湿度敏感等级:3
功能数量:1端子数量:100
字数:4194304 words字数代码:4000000
工作模式:SYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:4MX18
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:QFF封装等效代码:QFP100,.63X.87
封装形状:RECTANGULAR封装形式:FLATPACK
并行/串行:PARALLEL电源:2.5 V
认证状态:Not Qualified座面最大高度:1.4 mm
最小待机电流:2.38 V子类别:SRAMs
最大压摆率:0.45 mA最大供电电压 (Vsup):2.625 V
最小供电电压 (Vsup):2.375 V标称供电电压 (Vsup):2.5 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:Matte Tin (Sn)
端子形式:FLAT端子节距:0.65 mm
端子位置:QUAD宽度:14 mm
Base Number Matches:1

CY7C1482BV25-200AXC 数据手册

 浏览型号CY7C1482BV25-200AXC的Datasheet PDF文件第2页浏览型号CY7C1482BV25-200AXC的Datasheet PDF文件第3页浏览型号CY7C1482BV25-200AXC的Datasheet PDF文件第4页浏览型号CY7C1482BV25-200AXC的Datasheet PDF文件第5页浏览型号CY7C1482BV25-200AXC的Datasheet PDF文件第6页浏览型号CY7C1482BV25-200AXC的Datasheet PDF文件第7页 
CY7C1480BV25  
CY7C1482BV25, CY7C1486BV25  
72-Mbit (2M x 36/4M x 18/1M x 72)  
Pipelined Sync SRAM  
Features  
Functional Description  
Supports bus operation up to 250 MHz  
Available speed grades are 250, 200, and 167 MHz  
Registered inputs and outputs for pipelined operation  
2.5V core power supply  
The  
CY7C1480BV25/CY7C1482BV25/CY7C1486BV25[1]  
SRAM integrates 2M x 36/4M x 18/1M × 72 SRAM cells with  
advanced synchronous peripheral circuitry and a two-bit counter  
for internal burst operation. All synchronous inputs are gated by  
registers controlled by a positive-edge-triggered Clock Input  
(CLK). The synchronous inputs include all addresses, all data  
inputs, address-pipelining Chip Enable (CE1), depth-expansion  
Chip Enables (CE2 and CE3), Burst Control inputs (ADSC,  
ADSP, and ADV), Write Enables (BWX, and BWE), and Global  
Write (GW). Asynchronous inputs include the Output Enable  
(OE) and the ZZ pin.  
2.5V IO operation  
Fast clock-to-output time  
3.0 ns (for 250 MHz device)  
Provide high performance 3-1-1-1 access rate  
Addresses and chip enables are registered at rising edge of  
clock when either Address Strobe Processor (ADSP) or Address  
Strobe Controller (ADSC) is active. Subsequent burst addresses  
can be internally generated as controlled by the Advance pin  
(ADV).  
User selectable burst counter supporting Intel® Pentium®  
interleaved or linear burst sequences  
Separate processor and controller address strobes  
Synchronous self timed writes  
Address, data inputs, and write controls are registered on-chip  
to initiate a self timed Write cycle. This part supports Byte Write  
operations (see “Pin Definitions” on page 7 and “Truth Table” on  
page 10 for further details). Write cycles can be one to two or four  
bytes wide, as controlled by the byte write control inputs. When  
it is active LOW, GW writes all bytes.  
Asynchronous output enable  
Single cycle chip deselect  
CY7C1480BV25, CY7C1482BV25 available in  
JEDEC-standard Pb-free 100-pin TQFP, Pb-free and  
non-Pb-free 165-ball FBGA package. CY7C1486BV25  
available in Pb-free and non-Pb-free 209-ball FBGA package  
IEEE 1149.1 JTAG-Compatible Boundary Scan  
“ZZ” Sleep Mode option  
Selection Guide  
Description  
Maximum Access Time  
250 MHz  
3.0  
200 MHz  
3.0  
167 MHz  
3.4  
Unit  
ns  
Maximum Operating Current  
Maximum CMOS Standby Current  
450  
450  
400  
mA  
mA  
120  
120  
120  
Note  
1. For best practices recommendations, refer to the Cypress application note AN1064, SRAM System Guidelines.  
Cypress Semiconductor Corporation  
Document #: 001-15143 Rev. *D  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised February 29, 2008  
[+] Feedback  

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