CY7C1480BV25
CY7C1482BV25, CY7C1486BV25
72-Mbit (2M x 36/4M x 18/1M x 72)
Pipelined Sync SRAM
Features
Functional Description
■ Supports bus operation up to 250 MHz
■ Available speed grades are 250, 200, and 167 MHz
■ Registered inputs and outputs for pipelined operation
■ 2.5V core power supply
The
CY7C1480BV25/CY7C1482BV25/CY7C1486BV25[1]
SRAM integrates 2M x 36/4M x 18/1M × 72 SRAM cells with
advanced synchronous peripheral circuitry and a two-bit counter
for internal burst operation. All synchronous inputs are gated by
registers controlled by a positive-edge-triggered Clock Input
(CLK). The synchronous inputs include all addresses, all data
inputs, address-pipelining Chip Enable (CE1), depth-expansion
Chip Enables (CE2 and CE3), Burst Control inputs (ADSC,
ADSP, and ADV), Write Enables (BWX, and BWE), and Global
Write (GW). Asynchronous inputs include the Output Enable
(OE) and the ZZ pin.
■ 2.5V IO operation
■ Fast clock-to-output time
❐ 3.0 ns (for 250 MHz device)
■ Provide high performance 3-1-1-1 access rate
Addresses and chip enables are registered at rising edge of
clock when either Address Strobe Processor (ADSP) or Address
Strobe Controller (ADSC) is active. Subsequent burst addresses
can be internally generated as controlled by the Advance pin
(ADV).
■ User selectable burst counter supporting Intel® Pentium®
interleaved or linear burst sequences
■ Separate processor and controller address strobes
■ Synchronous self timed writes
Address, data inputs, and write controls are registered on-chip
to initiate a self timed Write cycle. This part supports Byte Write
operations (see “Pin Definitions” on page 7 and “Truth Table” on
page 10 for further details). Write cycles can be one to two or four
bytes wide, as controlled by the byte write control inputs. When
it is active LOW, GW writes all bytes.
■ Asynchronous output enable
■ Single cycle chip deselect
■ CY7C1480BV25, CY7C1482BV25 available in
JEDEC-standard Pb-free 100-pin TQFP, Pb-free and
non-Pb-free 165-ball FBGA package. CY7C1486BV25
available in Pb-free and non-Pb-free 209-ball FBGA package
■ IEEE 1149.1 JTAG-Compatible Boundary Scan
■ “ZZ” Sleep Mode option
Selection Guide
Description
Maximum Access Time
250 MHz
3.0
200 MHz
3.0
167 MHz
3.4
Unit
ns
Maximum Operating Current
Maximum CMOS Standby Current
450
450
400
mA
mA
120
120
120
Note
1. For best practices recommendations, refer to the Cypress application note AN1064, SRAM System Guidelines.
Cypress Semiconductor Corporation
Document #: 001-15143 Rev. *D
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised February 29, 2008
[+] Feedback