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CY7C1475V25-133BX PDF预览

CY7C1475V25-133BX

更新时间: 2024-09-18 20:37:15
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 时钟静态存储器内存集成电路
页数 文件大小 规格书
26页 1015K
描述
ZBT SRAM, 1MX72, 6.5ns, CMOS, PBGA209

CY7C1475V25-133BX 技术参数

生命周期:ActiveReach Compliance Code:compliant
风险等级:5.8最长访问时间:6.5 ns
最大时钟频率 (fCLK):133 MHzI/O 类型:COMMON
JESD-30 代码:R-PBGA-B209内存密度:75497472 bit
内存集成电路类型:ZBT SRAM内存宽度:72
端子数量:209字数:1048576 words
字数代码:1000000工作模式:SYNCHRONOUS
组织:1MX72输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:BGA
封装等效代码:BGA209,11X19,40封装形状:RECTANGULAR
封装形式:GRID ARRAY并行/串行:PARALLEL
电源:1.8/2.5,2.5 V认证状态:Not Qualified
最小待机电流:2.38 V子类别:SRAMs
表面贴装:YES技术:CMOS
端子形式:BALL端子节距:1 mm
端子位置:BOTTOMBase Number Matches:1

CY7C1475V25-133BX 数据手册

 浏览型号CY7C1475V25-133BX的Datasheet PDF文件第2页浏览型号CY7C1475V25-133BX的Datasheet PDF文件第3页浏览型号CY7C1475V25-133BX的Datasheet PDF文件第4页浏览型号CY7C1475V25-133BX的Datasheet PDF文件第5页浏览型号CY7C1475V25-133BX的Datasheet PDF文件第6页浏览型号CY7C1475V25-133BX的Datasheet PDF文件第7页 
CY7C1471V25  
CY7C1473V25  
CY7C1475V25  
ADVANCE  
INFORMATION  
2M x 36/4M x 18/1M x 72 Flow-through  
SRAM with NoBL™ Architecture  
Clock Enable (CEN), Byte Write Selects (BWSa, BWSb,  
BWSc, BWSd, BWSe, BWSf, BWSg, BWSh), and read-write  
control (WE). BWSc and BWSd apply to CY7C1471V25 and  
CY7C1475V25 only. BWSe, BWSf, BWSg, and BWSh apply to  
CY7C1475V25 only.  
Features  
Zero Bus Latency, no dead cycles between write and  
read  
Supports 133-MHz bus operations  
2M × 36/4M × 18/1M × 72 common I/O  
Fast clock-to-output times  
5.5 ns (for 150-MHz device)  
6.5 ns (for 133-MHz device)  
7.5 ns (for 117-MHz device)  
8.5 ns (for 100-MHz device)  
A
Clock Enable (CEN) pin allows operation of the  
CY7C1471V25, CY7C1473V25, and CY7C1475V25 to be  
suspended as long as necessary. All synchronous inputs are  
ignored when (CEN) is HIGH, and the internal device registers  
hold their previous values.  
There are three Chip Enable (CE1, CE2, CE3) pins that allow  
the user to deselect the device when desired. If any one of  
these three are not active when ADV/LD is LOW, no new  
memory operation can be initiated and any burst cycle in  
progress is stopped. However, any pending data transfers  
(read or write) will be completed. The data bus will be in  
high-impedance state two cycles after chip is deselected or a  
write cycle is initiated.  
Single 2.5V 5% and +5% power supply VDD  
Separate VDDQ for 2.5V or 1.8V I/O  
Clock Enable (CEN) pin to suspend operation  
Burst Capabilitylinear or interleaved burst order  
Available in 119-ball bump BGA and 100-pin TQFP  
packages (CY7C1471V25 and CY7C1473V25). 209  
FBGA package for CY7C1475V25.  
The CY7C1471V25,CY7C1473V25 and CY7C1475V25 have  
an on-chip two-bit burst counter. In the burst mode,  
CY7C1471V25, CY7C1473V25, and CY7C1475V25 provide  
four cycles of data for a single address presented to the  
SRAM. The order of the burst sequence is defined by the  
MODE input pin. The MODE pin selects between linear and  
interleaved burst sequence. The ADV/LD signal is used to load  
a new external address (ADV/LD = LOW) or increment the  
internal burst counter (ADV/LD = HIGH).  
Functional Description  
The CY7C1471V25, CY7C1473V25, and CY7C1475V25  
SRAMs are designed to eliminate dead cycles when transi-  
tions from Read to Write or vice versa. These SRAMs are  
optimized for 100 percent bus utilization and achieves Zero  
Bus Latency. They integrate 2,097,152 × 36/4,194,304 ×  
18/1,048,576 × 72 SRAM cells, respectively, with advanced  
synchronous peripheral circuitry and a two-bit counter for  
internal burst operation. The Synchronous Burst SRAM family  
employs high-speed, low-power CMOS designs using  
advanced single layer polysilicon, three-layer metal  
technology. Each memory cell consists of six transistors.  
Output Enable (OE) and burst sequence select (MODE) are  
the asynchronous signals. OE can be used to disable the  
outputs at any given time. ZZ may be tied to LOW if it is not  
used.  
Four pins are used to implement JTAG test capabilities. The  
JTAG circuitry is used to serially shift data to and from the  
device. JTAG inputs use LVTTL/LVCMOS levels to shift data  
during this testing mode of operation.  
All synchronous inputs are gated by registers controlled by a  
positive-edge-triggered Clock Input (CLK). The synchronous  
inputs include all addresses, all data inputs, depth-expansion  
Chip Enables (CE1, CE2, and CE3), cycle start input (ADV/LD),  
Logic Block Diagram  
D
CLK  
Data-In REG.  
CE  
Q
ADV/LD  
A
x
CEN  
CE  
CONTROL  
and Write  
LOGIC  
2M × 36/  
4M × 18/  
1M × 72  
MEMORY  
ARRAY  
1
CE  
2
DQ  
x
CE  
DQ  
3
A
BWS  
X
DP  
X
X
X
DP  
WE  
x
BWS  
X = a, b,  
c, d  
x
X = a, b, X= a, b,  
X = 20:0  
X = 21:0  
2M × 36  
c, d  
c, d  
Mode  
X = a, b  
X = a, b X = a, b  
4M × 18  
1M × 72  
X = a, b,  
X = a, b,  
X = a, b,  
X = 19:0  
OE  
c,d,e,f,g,h  
c,d,e,f,g,h  
c,d,e,f,g,h  
Cypress Semiconductor Corporation  
3901 North First Street  
San Jose  
CA 95134  
408-943-2600  
Document #: 38-05287 Rev. **  
Revised August 2, 2002  

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