是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | 15 X 17 MM, 1.40 MM HEIGHT, FBGA-165 |
针数: | 165 | Reach Compliance Code: | compliant |
ECCN代码: | 3A991.B.2.A | HTS代码: | 8542.32.00.41 |
风险等级: | 5.92 | 最长访问时间: | 8.5 ns |
其他特性: | FLOW-THROUGH ARCHITECTURE | 最大时钟频率 (fCLK): | 100 MHz |
I/O 类型: | COMMON | JESD-30 代码: | R-PBGA-B165 |
长度: | 17 mm | 内存密度: | 75497472 bit |
内存集成电路类型: | ZBT SRAM | 内存宽度: | 18 |
功能数量: | 1 | 端子数量: | 165 |
字数: | 4194304 words | 字数代码: | 4000000 |
工作模式: | SYNCHRONOUS | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 组织: | 4MX18 |
输出特性: | 3-STATE | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | LBGA | 封装等效代码: | BGA165,11X15,40 |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, LOW PROFILE |
并行/串行: | PARALLEL | 电源: | 1.8/2.5,2.5 V |
认证状态: | Not Qualified | 座面最大高度: | 1.4 mm |
最大待机电流: | 0.12 A | 最小待机电流: | 2.38 V |
子类别: | SRAMs | 最大压摆率: | 0.275 mA |
最大供电电压 (Vsup): | 2.625 V | 最小供电电压 (Vsup): | 2.375 V |
标称供电电压 (Vsup): | 2.5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子形式: | BALL | 端子节距: | 1 mm |
端子位置: | BOTTOM | 宽度: | 15 mm |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
CY7C1473BV25-100BZXC | CYPRESS |
获取价格 |
72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Throug | |
CY7C1473BV25-100BZXI | CYPRESS |
获取价格 |
72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Throug | |
CY7C1473BV25-133AXC | CYPRESS |
获取价格 |
72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Throug | |
CY7C1473BV25-133AXI | CYPRESS |
获取价格 |
72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Throug | |
CY7C1473BV25-133BZC | CYPRESS |
获取价格 |
72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Throug | |
CY7C1473BV25-133BZI | CYPRESS |
获取价格 |
72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Throug | |
CY7C1473BV25-133BZXC | CYPRESS |
获取价格 |
72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Throug | |
CY7C1473BV25-133BZXI | CYPRESS |
获取价格 |
72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Throug | |
CY7C1473BV33 | CYPRESS |
获取价格 |
72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM with NoBL Architecture | |
CY7C1473BV33-117AXC | CYPRESS |
获取价格 |
72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM with NoBL Architecture |