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CY7C1472V25-167AC PDF预览

CY7C1472V25-167AC

更新时间: 2024-09-18 06:54:07
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 时钟静态存储器内存集成电路
页数 文件大小 规格书
28页 474K
描述
ZBT SRAM, 4MX18, 3.4ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100

CY7C1472V25-167AC 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:QFP包装说明:14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100
针数:100Reach Compliance Code:compliant
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.5最长访问时间:3.4 ns
其他特性:PIPELINED ARCHITECTURE最大时钟频率 (fCLK):167 MHz
I/O 类型:COMMONJESD-30 代码:R-PQFP-G100
长度:20 mm内存密度:75497472 bit
内存集成电路类型:ZBT SRAM内存宽度:18
功能数量:1端子数量:100
字数:4194304 words字数代码:4000000
工作模式:SYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:4MX18
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:LQFP封装等效代码:QFP100,.63X.87
封装形状:RECTANGULAR封装形式:FLATPACK, LOW PROFILE
并行/串行:PARALLEL电源:1.8/2.5,2.5 V
认证状态:Not Qualified座面最大高度:1.6 mm
最小待机电流:2.38 V子类别:SRAMs
最大供电电压 (Vsup):2.625 V最小供电电压 (Vsup):2.375 V
标称供电电压 (Vsup):2.5 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子形式:GULL WING端子节距:0.65 mm
端子位置:QUAD宽度:14 mm
Base Number Matches:1

CY7C1472V25-167AC 数据手册

 浏览型号CY7C1472V25-167AC的Datasheet PDF文件第2页浏览型号CY7C1472V25-167AC的Datasheet PDF文件第3页浏览型号CY7C1472V25-167AC的Datasheet PDF文件第4页浏览型号CY7C1472V25-167AC的Datasheet PDF文件第5页浏览型号CY7C1472V25-167AC的Datasheet PDF文件第6页浏览型号CY7C1472V25-167AC的Datasheet PDF文件第7页 
CY7C1470V25  
CY7C1472V25  
CY7C1474V25  
PRELIMINARY  
2M x 36/4M x 18/1M x 72 Pipelined SRAM  
with NoBL™ Architecture  
inputs include all addresses, all data inputs, depth-expansion  
Chip Enables (CE1, CE2, and CE3), cycle start input (ADV/LD),  
Clock Enable (CEN), Byte Write Selects (BWSa, BWSb,  
BWSc, BWSd, BWSe, BWSf, BWSg, BWSh), and Read-Write  
control (WE). BWSc and BWSd apply to CY7C1470V25 and  
CY7C1474V25 only. BWSe, BWSf, BWSg, and BWSh apply to  
CY7C1474V25 only.  
Features  
• Zero Bus Latency™, no dead cycles between Write and  
Read cycles  
• Fast clock speed: 250, 200, and 167 MHz  
• Fast access time: 2.6, 3.0, and 3.4 ns  
• Internally synchronized registered outputs eliminate  
the need to control OE  
Address and control signals are applied to the SRAM during  
one clock cycle, and two cycles later its associated data  
occurs, either Read or Write.  
• Single 2.5V + 5%/–5%  
• Separate VDDQ for 2.5V or 1.8V I/O  
• Single WE (Read/Write) control pin  
• Positive clock-edge triggered, address, data, and  
control signal registers for fully pipelined applications  
• Interleaved or linear four-word burst capability  
A
Clock Enable (CEN) pin allows operation of the  
CY7C1470V25, CY7C1472V25, and CY7C1474V25 to be  
suspended as long as necessary. All synchronous inputs are  
ignored when (CEN) is HIGH and the internal device registers  
will hold their previous values.  
• Individual byte Write (BWSa–BWSh) control (may be  
tied LOW)  
• CEN pin to enable clock and suspend operations  
• Three chip enables for simple depth expansion  
• JTAG boundary scan for BGA packaging version  
• Available in 119-ball bump BGA and 100-pin TQFP  
packages (CY7C1470V25 and CY7C1472V25). 209-ball  
BGA package for CY7C1474V25.  
There are three Chip Enable (CE1, CE2, CE3) pins that allow  
the user to deselect the device when desired. If any one of  
these three are not active when ADV/LD is low, no new  
memory operation can be initiated and any burst cycle in  
progress is stopped. However, any pending data transfers  
(read or write) will be completed. The data bus will be in high  
impedance state two cycles after chip is deselected or a write  
cycle is initiated.  
• 165-ball FBGA package is offered by opportunity basis  
(Please contact Cypress sales or marketing)  
The CY7C1470V25, CY7C1472V25, and CY7C1474V25  
have an on-chip two-bit burst counter. In the burst mode,  
CY7C1470V25, CY7C1472V25, and CY7C1474V25 provide  
four cycles of data for a single address presented to the  
SRAM. The order of the burst sequence is defined by the  
MODE input pin. The MODE pin selects between linear and  
interleaved burst sequence. The ADV/LD signal is used to load  
a new external address (ADV/LD = LOW) or increment the  
internal burst counter (ADV/LD = HIGH).  
Functional Description  
The CY7C1470V25, CY7C1472V25, and CY7C1474V25  
SRAMs are designed to eliminate dead cycles when transi-  
tions from Read to Write or vice versa. These SRAMs are  
optimized for 100% bus utilization and achieve Zero Bus  
Latency. They integrate 2,097,152 × 36/4,194,304 × 18/  
1,048,576 × 72 SRAM cells, respectively, with advanced  
synchronous peripheral circuitry and a two-bit counter for  
internal burst operation. The Cypress Synchronous Burst  
SRAM family employs high-speed, low-power CMOS designs  
using advanced single layer polysilicon, three-layer metal  
technology. Each memory cell consists of six transistors.  
Output Enable (OE) and burst sequence select (MODE) are  
the asynchronous signals. OE can be used to disable the  
outputs at any given time. ZZ may be tied to LOW if it is not  
used.  
Four pins are used to implement JTAG test capabilities. The  
JTAG circuitry is used to serially shift data to and from the  
device. JTAG inputs use LVTTL/LVCMOS levels to shift data  
during this testing mode of operation.  
All synchronous inputs are gated by registers controlled by a  
positive-edge-triggered Clock Input (CLK). The synchronous  
Cypress Semiconductor Corporation  
Document #: 38-05290 Rev. *A  
3901 North First Street  
San Jose, CA 95134  
408-943-2600  
Revised January 22, 2003  

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